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Thermal Management of Fujitsu High-End Unix Servers

机译:富士通高端Unix服务器的热管理

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摘要

An overview of system packaging and thermal management of the Fujitsu high-performance Unix server PRIMEPOWER HPC2500 is introduced in the present paper. Each node of the HPC2500 comprises sixteen system boards containing up to 128 SPARC64V CPU processors, with the maximum power dissipation about 30kW. A full configuration of the HPC2500 can be further scaled up to the maximum of 128 nodes, resulting in 16,384 CPU processors installed. Thermal management is introduced from viewpoints of the server-cabinet, system-board and CPU processor module levels, respectively. A design strategy of the forced convection air cooling scheme is outlined, implemented to meet increased demanding requirements of high density packaging, high power and power-density dissipations. Furthermore, thermal challenges, arising from high asymmetric power distributions and dissipations of CPU processors, are investigated for high performance computers. Temperature distributions of the CPU processors, effects of heat spreading materials (HIS) and impacts of thermal interface materials (TIM) on the cooling and packaging designs are also analysed and illustrated.
机译:本文介绍了富士通高性能Unix服务器PRIMEPOWER HPC2500的系统封装和热管理。 HPC2500的每个节点包括16个系统板,其中包含多达128个SPARC64V CPU处理器,最大功耗约为30kW。 HPC2500的完整配置可以进一步扩展到最大128个节点,从而安装了16,384个CPU处理器。分别从服务器机柜,主板和CPU处理器模块级别的角度介绍了热管理。概述了强制对流空气冷却方案的设计策略,以实现对高密度封装,高功率和功率密度耗散的日益增长的要求。此外,针对高性能计算机,还研究了由于CPU处理器的高不对称功率分布和功耗而引起的散热挑战。还分析并说明了CPU处理器的温度分布,散热材料(HIS)的影响以及热界面材料(TIM)对冷却和封装设计的影响。

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