RECENT PROGRESS IN SURFACE ACTIVATED BONDING

机译：表面活化粘接的最新进展

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摘要

The surface activated bonding method is based on a very simple principle, so a variety of applications in different fields are possible.

机译：表面活化键合方法基于非常简单的原理，因此在不同领域中可以有多种应用。

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来源
《Ceramic microstructures : Control at the atomic level》|1996年|385-389|共5页
会议地点 Berkeley CA(US)
作者
Tadatomo Suga;
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作者单位

The University of Tokyo, RCAST Meguro-ku, Tokyo 153, Japan;

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原文格式 PDF
正文语种 eng
中图分类 TQ174.01;
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1. A comparison study: Direct wafer bonding of SiC-SiC by standard surface-activated bonding and modified surface-activated bonding with Si-containing Ar ion beam [J] . Mu Fengwen, Iguchi Kenichi, Nakazawa Haruo, Annales de l'I.H.P . 2016,第8期

机译：比较研究：SiC-SiC通过标准表面活化粘合的直接晶片键合，并用含Si的Ar离子束改性表面活化键合
2. Activation of wood surfaces for glue bonds by mechanical pre-treatment and its effects on some properties of veneer surfaces and plywood panels [J] . Ismail Aydin Applied Surface Science . 2004,第1a4期

机译：通过机械预处理活化木材表面的胶粘剂及其对单板表面和胶合板的某些性能的影响
3. Mechanism of bonding and debonding using surface activated bonding method with Si intermediate layer [J] . Takeuchi Kai, Fujino Masahisa, Matsumoto Yoshiie, Japanese journal of applied physics . 2018,第4S期

机译：表面活化键合方法与Si中间层的键合和解键机理
4. RECENT PROGRESS IN SURFACE ACTIVATED BONDING [C] . International materials symposium on ceramic microstructures: Control at the atomic level . 1998

机译：表面激活粘合的最新进展
5. Late-metal C -H bond activation: Cyclopropane functionalizations and progress toward the C-H σ-bond complex [D] . Anstey, Mitchell Ryan 2009

机译：后期金属C -H键活化：环丙烷官能化及其向C-Hσ键络合物的发展
6. Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding [O] . Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, 2020

机译：金膜厚度和表面粗糙度对室温晶圆键合和金-金表面活化键合的晶圆级真空密封的影响
7. Cu/Cu bonding and SiO₂/SiO₂ bonding by surface activated bonding at room temperature for hybrid bonding technique [O] . Jun UTSUMI, Kensuke IDE 2015

机译：Cu / Cu键合和SiO _{2 / siO _{2 通过表面活化键合在室温下进行混合粘合技术}}
8. Chemistry of oxygenates on transition metal surfaces: Activation of C- H, C-C, and C-O bonds. Progress report, December 15, 1991 [R] . 1991

机译：过渡金属表面上的含氧化合物的化学：C-H，C-C和C-O键的活化。进展报告，1991年12月15日

RECENT PROGRESS IN SURFACE ACTIVATED BONDING

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