首页> 外文会议>Chemical mechanical polishing 12 >Studies on Slurry Design Fundamentals for Advanced CMP Applications CMP
【24h】

Studies on Slurry Design Fundamentals for Advanced CMP Applications CMP

机译:先进CMP应用的浆料设计基础研究

获取原文
获取原文并翻译 | 示例

摘要

New developments and device performance requirements in microelectronics industry add to the challenges in chemical mechanical planarization (CMP) process. One of the recently introduced materials is germanium which enables improved performance through better channel mobility in shallow trench isolation (STI) applications. This paper reports on the slurry design alternatives for Ge CMP with surfactant mediation to improve on the silica/germanium selectivity using colloidal silica slurry. In addition to the standard CMP tests to evaluate the material removal rates, atomic force microscopy (AFM) based wear tests were also conducted to evaluate single particle-surface interaction of the polishing system. Furthermore, nature of the surface oxide film of germanium was studied through contact angle measurements and surface roughness tested by AFM. It was observed that the CMP selectivity of the silica/germanium system and defectivity control were possible with a reasonable material removal rate value by using self-assembled structures of cationic surfactants.
机译:微电子工业中的新发展和器件性能要求增加了化学机械平面化(CMP)工艺的挑战。最近引入的材料之一是锗,它可以通过在浅沟槽隔离(STI)应用中提供更好的沟道迁移率来提高性能。本文报道了使用表面活性剂介导的Ge CMP浆料设计方案,以提高使用胶态二氧化硅浆料的二氧化硅/锗选择性。除了用于评估材料去除率的标准CMP测试之外,还进行了基于原子力显微镜(AFM)的磨损测试,以评估抛光系统的单颗粒-表面相互作用。此外,通过接触角测量和通过AFM测试的表面粗糙度,研究了锗的表面氧化物膜的性质。观察到,通过使用阳离子表面活性剂的自组装结构,可以以合理的材料去除率值实现二氧化硅/锗体系的CMP选择性和缺陷率控制。

著录项

  • 来源
  • 会议地点 Honolulu HI(US)
  • 作者单位

    Department of Mechanical Engineering, Ozyegin University, Istanbul 34794, Turkey;

    Department of Mechanical Engineering, Ozyegin University, Istanbul 34794, Turkey;

    Department of Mechanical Engineering, Ozyegin University, Istanbul 34794, Turkey;

    Department of Physical Sciences and Engineering, King Abdullah University of Science and Technology, Thuwal 23955, Saudi Arabia;

    Department of Physical Sciences and Engineering, King Abdullah University of Science and Technology, Thuwal 23955, Saudi Arabia;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号