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首页> 外文会议>CMP-MIC Catalog no.05 IMIC - 1000P; International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference(CMP-MIC); 20050223-25; Fremont,CA(US) >Challenges of Implementing New Slurry Chemistries in High Volume Manufacturing
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Challenges of Implementing New Slurry Chemistries in High Volume Manufacturing

机译：在大批量生产中实施新浆化学的挑战

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摘要

Introducing new slurry into a process that is already running High Volume Manufacturing (HVM) on multiple processes presents many challenges and requires a more thorough qualification process than the startup of a new process. General lessons learned from recent slurry qualification activities at a 200 mm Intel Corp fab will be discussed. The risks to existing production products are very high when making changes in HVM. It becomes even more critical to exactly match the existing process. The variables to match include dishing, dishing uniformity, removal rate, removal rate uniformity, defects, electromigration, polish endpoint time, electrical resistance, leakage current and yield. The change must be able to be implemented in a manner that controls risk and this incurs significant additional expense. Many of these challenges could be addressed sooner in the process with the help of the slurry vendor. Some suggestions for improved vendor coordination include identifying analytical techniques that are HVM ready for the customer to monitor slurry quality in the distribution system, monitoring the appropriate variables, and providing sufficient samples to understand lot to lot variability.
机译：将新浆液引入到已经在多个过程中运行了大批量生产（HVM）的过程中，提出了许多挑战，并且比启动新过程需要更彻底的鉴定过程。将讨论从最近在200毫米Intel Corp晶圆厂进行浆液鉴定活动中学到的一般经验教训。更改HVM时，现有生产产品的风险非常高。精确匹配现有过程变得更加关键。匹配的变量包括凹陷，凹陷均匀度，去除速率，去除速率均匀性，缺陷，电迁移，抛光终点时间，电阻，漏电流和良率。更改必须能够以控制风险的方式实施，并且会产生大量额外费用。在浆液供应商的帮助下，许多这些挑战可以在过程中尽快解决。改善供应商协调性的一些建议包括确定分析技术，这些技术已准备好供客户使用HVM来监控分配系统中的浆料质量，监控适当的变量，并提供足够的样本以了解批次之间的差异。

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