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首页> 外文会议>Conference on Challenges in Process Integration and Device Technology 18-19 September 2000 Santa Clara, USA >Low Energy Neutral Processing and Process Characterization
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Low Energy Neutral Processing and Process Characterization

机译：低能耗中性加工和工艺表征

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摘要

The purpose of this paper is to present a novel charge-free processing method which could be integrated for future generation feature production. The source reported here is a surface-reflection neutralization based inductively coupled plasma sources. Experiments and simulations show that this source can produce enough low energy fast neutrals for ashing applications. The cleaning efficiency and stripping rates are characterized as a function of operating parameters. Measurements using a heat flux momentum analyzer show the neutral flux is on the order 10~15 cm~-2s~-1 and the neutral energy is tunable between 3approx 6 eV. Process damage assessment by various plasma processes, such as continuous vs. Pulsed plasmas, has been included in this paper. These results demonstrate this source is promising for developing soft-landing steps suitable for fragile features.
机译：本文的目的是提出一种新颖的免电荷处理方法，该方法可以集成到下一代特征生产中。此处报道的源是基于表面反射中和的电感耦合等离子体源。实验和模拟表明，该源可以产生足够的低能量快速中性灰，用于灰化应用。清洁效率和汽提速率取决于操作参数。使用热通量动量分析仪进行的测量表明，中性通量约为10〜15 cm〜-2s〜-1，中性能量在3约6 eV之间可调。本文包括通过各种等离子体工艺（例如连续等离子体与脉冲等离子体）进行的工艺损伤评估。这些结果表明，该来源有望用于开发适用于脆弱特征的软着陆步骤。

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