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Conference on challenges in process integration and device technology

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1.Process Development of 50A IMP Ti Film with <2

机译：50A IMP TI薄膜的过程开发<2
- 作者：Xinyu Zhang;Ian Pancham;Anthony C-T Chan;Mani Subamani;John Forster;Jim van Gogh;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- 300mm iLB;
- IMP;
- Ti;
- Thickness Uniformity;
- Target to Substrate Spacing;
2.Evolution of semiconductor process technology

机译：半导体工艺技术的演变
- 作者：Trung T.Doan;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
3.Micro-structuring with 193nm Laser Radiation

机译：带193nm激光辐射的微结构化
- 作者：Zhang Lin;Lou Qihong;Wei Yunrong;Huang Feng;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- excimer laser;
- ablation;
- three-dimensional topographies;
- Fresnel lens;
4.Automated OPC optimization using in-line CD-SEM

机译：使用在线CD-SEM自动化OPC优化
- 作者：Bo Su;Mina Menaker;Nadav Haas;Ramkumar Subramanian;Bhanwar Singh;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- lithography;
- image transfer;
- mask OPC;
- optimization;
- CD-SEM;
5.Thickness-dependent optical and dielectric behaviors of low-k polymer thin films

机译：低k聚合物薄膜的厚度依赖性光学和介电行为
- 作者：U.K.Kim;F.G.Shi;B.Zhao;M.Brongo;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- Thickness dependence;
- refractive index;
- temperature coefficient of refractive index;
- dielectric strength;
6.Modeling of the removal rate in chemical mechanical polishing

机译：化学机械抛光中去除率的建模
- 作者：Van. H. Nguyen;Frank. G. Shi
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- chemical mechanical polishing;
- slurry;
- polishing pad;
- critical pressure;
7.MEEF measurement and model verification for 0.3 kl lithography

机译：0.3 KL光刻的MEEF测量和模型验证
- 作者：Colin R.Parker;Michael T.Reilly;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- MEEF;
- mask error;
- bias;
- NA;
- OPC;
8.Isothermal Test as a WLR Monitor for Cu Interconnects

机译：等温测试作为CU互连的WLR监视器
- 作者：Amit Marathe;Van Pham;Jay Chan;Jorg-Oliver Weidner;Volker Heining;Steffi Thierbach;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- Isothermal;
- electromigration;
- WLR monitor;
- Cu interconnects;
- Flux divergence.;
9.Technology of electroplating copper with low-K material a-C:F for 0.15 um damascene interconnection

机译：用低k材料电镀铜技术A-C：F为0.15米镶嵌互连
- 作者：Jia-Min Shieh;Shich-Chang Suen;Kuen-Chaung Lin;Shih-Chieh Chang;Bau-Tong Dai;Chia-Fu Chen;Ming-Shiann Feng;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
10.Pattern Placement Errors -Application of in-situ interferometer determined Zernike coefficients in determining printed image deviations

机译：模式放置误差 - 原位干涉仪的应用确定了确定打印图像偏差时的Zernike系数
- 作者：Bill Roberts;Chris Gould;Adlai Smith;Ken Rebitz;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
11.Modeling of the Removal ratein chemical mechanical polishing

机译：化学机械抛光中去除率的建模
- 作者：Van H.Nguyen;Frank G.Shi;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- Chemical mechanical polishing;
- slurry;
- polishing pad;
- critical pressure;
12.Investigation on the Impacts of Misalignment in the Integration of 0.18u multilevel Interconnect

机译：未对准对0.18U多级互连集成中的错位影响
- 作者：Teck Jung Tang;Juan Boon Tan;Sajan Markkey;Tae Jong Lee;Alan Cuthbertson;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- 0.18um;
- Misalignment;
- Integration;
- Multilevel;
- Interconnect;
- W-plug corrosion;
13.Optical Coherent Control in Materials with Stripe phase

机译：条纹阶段材料中的光学相干控制
- 作者：S.Alam;M.O.Rahman;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
14.The effect of stress and dopant redistribution on trench-isolated narrow devices

机译：应力和掺杂剂再分配对沟槽隔离窄装置的影响
- 作者：Gregory Scott;Faran Nouri;Mark Rubin;Martin Manley;Peter Stolk;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- shallow trench isolation;
- narrow CMOS devices;
- stress;
- segregation;
- transient enhanced diffusion;
15.Pattern Placement Errors - Application of in-situ interferometer determined Zernike coefficients in determining printed image deviations

机译：模式放置误差 - 原位干涉仪在确定印刷图像偏差时确定的Zernike系数的应用
- 作者：Bill Roberts;Chris Gould;Adlai Smith;Ken Rebitz
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
16.Feasibility of very low k1(=0.31) KrF lithography

机译：非常低的K1（= 0.31）KRF光刻的可行性
- 作者：In-Sung Kim;Byeong-Soo Kim;Jung-Hyeon Lee;Han-Ku Cho;Joo-Tae Moon;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- RrF;
- RET;
- OAI;
- Att;
- PSM;
- DRAM;
- D/R;
- I-D bias;
- DOF;
- OPC;
17.Etching characteristics of organic low-k dielectrics in the helicon-wave plasma etcher for 0.15um damascene architecture

机译：Helicon波等离子体蚀刻器中有机低k电介质的蚀刻特性0.15um镶嵌结构
- 作者：Jia-Min Shieh;T.C.Wei;C.H.Liu;Shich-Chang Suen;Bau-Tong Dai;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
18.The field effects in the dielectrics coated by ITO films

机译：ITO薄膜涂层介质中的田间效应
- 作者：J.Olesik;Z.Olesik;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
19.Backwafer optical lithography and wafer distortion in substrate transfer technologies

机译：基板传输技术中的反向光学光刻和晶片失真
- 作者：H.W.van Zeijl;J.Slabbekoorn;L.K.Nanver;P.W.L.van Dijk;A.Berthold;T.Machielsen;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- substrate transfer;
- alignment markers;
- overlay accuracy;
- wafer stepper maching;
- substrate distortion;
20.Laser-Induced Structure Defects and their Use for Modification of Properties of (Cd, Hg) Te Epitaxial Layers and CdTe Crystals

机译：激光诱导的结构缺陷及其用于改性（CD，HG）TE外延层和CDTE晶体的性质的用途
- 作者：Apollinariy Zaginey Kotlyarchuk;Yuriy Syvenkyy;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- laser;
- modification;
- structure;
- defect;
- mercury-cadmium telluride;
21.Measuring thickness of native oxide, crystalline-silicon, buried oxide layers, and the interface roughness of SOI

机译：测量天然氧化物，结晶 - 硅，掩埋氧化物层的厚度，以及SOI的界面粗糙度
- 作者：Iris Bloomer;G.G.Li;A.R.Forouhi;A.Auberton-Herve;A.Wittkower;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- SOI;
- thickness of thin films;
- n and k;
- thin film characterization;
- interface roughness;
22.Yield-limiting NMOSFET gate depletion in a deep sub-micron CMOS process

机译：在深次微米CMOS过程中产生限制NMOSFET栅极耗尽
- 作者：M.Karnett;S.Qian;T.Mitchell;V.Subsramaniam;H.Sur;B.Haby;H.Brugge;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- Amorphus silicon gate;
- gate depletion;
- boron penetration;
- threshold voltage;
- CMOS process;
- SRAM yield;
23.The design and fabrication of a GXGA microdisplay chip.

机译：GXGA微透视芯片的设计与制造。
- 作者：Paul M.F.Colson;Freddy De Pestel;Marnix Tack;Gust Schols;Herbert De Smet;Jean Van Den Steen;Andre Van Calster;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- Microdisplay;
- Light valve;
- GXGA resolution;
- Light Shield;
24.Sub-wavelength Optical Lithography

机译：子波长光学光刻
- 作者：Tsuneo Terasawa;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- Optical lithography;
- Resolution enhancement techniques;
- wavelength;
- Optical Proximity effect;
25.Prospective Technology for System-on-a-Chip: N_2 implant followed by VHP O_2 re-oxidation

机译：芯片系统的前瞻性技术：N_2植入物，其次是VHP O_2重新氧化
- 作者：T.Y.Luo;H.n.Al-Shareef;G.A.Brown;V.H.C.Watt;A.Karamcheti;M.D.Jackson;H.R.Huff;B.Evans;C.H.Lee;H.F.Luan;D.L.Kwong;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- System-on-a-Chip(SOC);
- N_2 ion implant (N_2 I/I);
- vertical high pressure (VHP) re-oxidation;
26.Scaling considerations for MOSFET devices with 25-nm channel lengths

机译：具有25nm通道长度的MOSFET器件的扩展考虑因素
- 作者：Samar Saha;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
27.Effects of Advanced Illumination Schemes on Design Manufacturability and Interactions with Optical Proximity Corrections

机译：高级照明方案对光学邻近校正设计可制造性和交互的影响
- 作者：Luigi Capodieci;Juan Andres Torres;Robert Socha;Uwe Hollerbach;J.Fung Chen;Christian van Os;Yuri Granik;Olivier Toublan;Nickolas Cobb;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- Manufacturability Verification;
- Lithography;
- Semiconductor Processing;
- OPC;
- DFM;
- Physical Verification;
- Optical Extensions;
- Process Window;
28.Is lithography ready for 300mm?

机译：光刻准备300毫米吗？
- 作者：Alain Charles;Clint Haris;Steffen Hornig;Dietmar Ganz;Thorsten Schedel;Cunther Hraschan;Wolfram Kostler;John Maltabes;Karl Mautz;Sebastian Schmidt;Ralf Schuster;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- Semiconductor;
- Lithography;
- Deep UV;
- I-line;
- Scanners;
- Steppers;
- Mixing and matching;
- Critical dimensions;
- Overlay;
- 300mm wafers;
29.Low Energy Neutral Processing and Process Characterization

机译：低能量中性处理和过程表征
- 作者：Xianmin Tang;Dennis M.Manos;Qi Wang;Christopher A.Nichols;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- Low damage;
- surface reflection neutralization;
- charge-free;
- photoresist;
30.Advanced Lithography Kits: Serifs and Hammerhead

机译：先进的光刻套件：Serifs和Hammerhead
- 作者：Hang-Yip (Daniel) Liu;Steffen Schulze;Alan Thomas;Anne McGuire;Michael Cross;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- Serifs;
- hammerhead;
- DRAM;
- storage;
- isolation;
- lithography;
- mask;
- simulations;
31.Planarization Approaches to Via-First Dual-Damascene Processing

机译：通过第一双镶嵌处理的平面化方法
- 作者：Edward K.Pavelchek;Marjorie Cernigliaro;Peter Trefonas;Manuel doCanto;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
32.Deciphering and Encoding Product Overlay - Hidden Errors

机译：解密和编码产品覆盖 - 隐藏错误
- 作者：Christopher J.Gould;William R.Boberts;Frank Goodwin;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
33.Correlation between the Reliability of Ultra-Thin ISSG SiO_2 and Hydrogen Content

机译：超薄ISIO_2和氢含量可靠性的相关性
- 作者：T.Y.Luo;H.N.Al-Shareef;G.A.Brown;M.Laughery;V.H.C.Watt;A.Karamcheti;M.D.Jackson;H.R.Huff;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
34.Benchmarking of Advanced CD-SEMs against the New Unified Specification for sub-0.18 Micrometer Lithography

机译：高级CD-SEM对副018微米光刻新统一规范的基准测试
- 作者：Alain G.Deleporte;John Allgair;Charles Archie;G.William Banke;Michael T.Postek;Jerry Schlesinger;Andras E.Vladar;Arnold Yanof;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- CD-SEM;
- lithography;
- metrology;
- accuracy;
- linewidth;
- specification;
- benchmarking;
35.Increasing Degree of Homogeneity of Electrical Parameters of Neutron-Transmuted Silicon

机译：中子传动硅电气参数的均匀性增加
- 作者：Sh.Makhkamov;N.A.Tursunov;M.Ashurov;Z.M.Khakimov;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- Silicon;
- neutron-transmutation;
- doping;
- thermal processing;
- life-time;
36.Design and Process issues affecting performance of optical interconnects on ICs,

机译：影响光学互连性能的设计和过程问题IC，
- 作者：B.L.Bhuva;D.Jiang;D.Kerns;S.Kerns;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- Optical Interconnect;
- avalanche Breakdown;
37.High Performance vs. Low Power Technology Roadmaps: How are they Different

机译：高性能与低功耗技术路线图：它们如何不同
- 作者：Dirk Wristers;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- high performance logic technology;
- low power technology;
- technology scalling;
38.Low-k Etch/Ash for Copper Dual Damascene

机译：用于铜双镶嵌的Low-K蚀刻/灰
- 作者：Tomoki Suemasa;Masaru Nishino;Kouichiro Inazawa;Vaidya N.B.;Eiichi Nishimura;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- low-k;
- Dual Damascene;
- Organic;
- Inorganic;
- MSQ;
- porous;
- etch;
- ash;
- in-situ ash;
39.Evaluation of Schottky Contact Parameters in MSM-Photodiode Structures

机译：MSM-Photodiode结构中肖特基接触参数的评估
- 作者：Stanislav V.Averine;Yuen Chuen Chan;Yee loy Lam;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- Photodiode;
- Schottky contact;
- barrier height;
- ideality factor;
- I-V characteristics;
- semiconductor;
40.Efficient Resist Edgebead Removal for Thick I-line Resist Coating Application on TEL Mark 7 Track System

机译：高效抗蚀剂边缘粘度厚I型抗蚀剂涂层在电话7轨道系统上的应用
- 作者：Quang Tran;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- Edgebead Resist Removal (EBR);
- Solvent EBR;
- Optical EBR;
- Thick Resist;
- TEL Mark 7;
- Defect;
- Solvent Nozzle;
41.Influence of the varyband layer of the amorphous hydrogenated silicon-germanium on the current-volt characteristics of the n~+(a-Si:H)- i(a-Si_1-xGe_x:H)-n~+(aSi:H)-structures.

机译：无定形氢化硅 - 锗的变化层对N〜+（A-Si：H） - I（A-Si_1-Xge_X：H）-N〜+（ASI：H）的电流 - 伏特特性的影响 - 结构。
- 作者：R.R.Kabulov;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- Manuscript format;
- template;
- SPIE Proceedings;
- Microsoft Word;
42.Novel Electrical Alignment Structure

机译：新型电气对准结构
- 作者：Todd Lukanc;Advanced Micro Devices;SPIE-The International Society for Optical Engineering
- 会议名称：《Conference on challenges in process integration and device technology》 | 2000年
- electrical alignment;
- test structures overlay;