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Evaluation of Schottky Contact Parameters in MSM-Photodiode Structures

机译:MSM-Photodiode结构中肖特基接触参数的评估

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The electrical behavior of metal-semiconductor-metal (MSM) Schottky barrier photodiode structures is analyzed by means of current-voltage (I-V) measurements at different temperatures. The reverse characteristics of the Schottky contact are examined by taking into account the barrier height dependence on the eletric field and tunneling through the barrier. It is shown that, under these conditions the I-V measurements can be used as a fast and simple method to evaluate the barrier height, saturation current density and junction ideality factor of the MSM-photodiode Schottky contact. The results are well consistent with experiment.
机译:通过在不同温度下的电流 - 电压(I-V)测量分析金属半导体 - 金属(MSM)肖特基势垒光电二极管结构的电动特性。通过考虑到Eletric场的屏障高度和隧道通过屏障隧穿的屏障高度依赖来检查肖特基触点的反向特性。结果表明,在这些条件下,I-V测量可以用作快速简单的方法,以评估MSM-PhotoDiode肖特基触点的屏障高度,饱和电流密度和结理想因子。结果与实验一致。

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