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首页> 外文会议>Conference on Challenges in Process Integration and Device Technology 18-19 September 2000 Santa Clara, USA >Novel Electrical Alignment Structure
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Novel Electrical Alignment Structure

机译：新型电对准结构

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摘要

As geometries continue to shrink and the equipment is pushed closer to its true limits, overlay and other printing parameters become a larger part of the total duaget. Overlay and CD measurements are sampeld "in line" to track and target tools. Adding these development and in manufacturing. Typical electrical alignment structures such as a resistor divider work well for a few layers but are limited to layers connecting to resistor elements. This paper describes a novel resistor ladder structure that can measure alignment between any 2 conducting layers as well as measure tip bullback, layer to layer patterning imapcts, and other characteristics in real device type payouts. Only mask generation and wafer printing capabilities limit the accuracy of the measurement.
机译：随着几何形状的不断缩小以及设备的逼近极限，覆盖面和其他打印参数已成为总Duaget的较大部分。叠加和CD测量“在线”采样以跟踪和定位工具。增加这些开发和制造。典型的电对准结构（例如电阻分压器）可以在几层上很好地工作，但仅限于连接到电阻元件的层。本文介绍了一种新颖的梯形电阻器结构，该结构可测量任意两个导电层之间的对准，并可测量端部回弹，层到层的图案化imapcts以及实际设备类型支出中的其他特征。仅掩模产生和晶片印刷能力限制了测量的准确性。

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