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From MEMS to the global simulation of SoCs

机译:从MEMS到SoC的全球仿真

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摘要

This paper is dealing with design, simulation and test of microsystems (microelectromechanical systems, MEMS). Both existing tools and open research areas are addressed. All through the paper, similarities between the present development of MEMS and the development of microelectronics decades ago are pointed out, including the migration from point tools to Computer-Aided Design (CAD) frameworks, testing, foundries/fabless business or Intellectual Property (IP) issues. Specific aspects such as thermal simulation of microstructures and thermomechanical design at the package level. The conclusion is depicting a possible global simulation scheme integrating the needs of Systems on Chip (SoCs) multilanguage simulation together with the needs of MEMS multipurpose simulation.
机译:本文涉及微系统(微机电系统,MEMS)的设计,仿真和测试。现有工具和开放研究领域均得到解决。贯穿本文,指出了MEMS的当前发展与几十年前的微电子发展之间的相似之处,包括从点工具到计算机辅助设计(CAD)框架,测试,铸造厂/无工厂业务或知识产权(IP)的迁移。 )问题。某些特定方面,例如封装级的微观结构热仿真和热机械设计。结论描述了一种可能的全局仿真方案,该方案将片上系统(SoC)多语言仿真的需求与MEMS多功能仿真的需求结合在一起。

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