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首页> 外文会议>Conference on Emerging Lithographic Technologies Ⅴ Feb 27-Mar 1, 2001, Santa Clara, USA >Layer-to-Layer Alignment for Step and Flash Imprint Lithography
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Layer-to-Layer Alignment for Step and Flash Imprint Lithography

机译：步进和闪光压印光刻的层到层对准

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摘要

The Step and Flash Imprint Lithography (SFIL) process is a low-cost, high-throughput patterning technique with a sub-100 nm resolution capability. Investigation by this group and others indicates that the resolution of replication by imprint lithography is limited only by the size of the structures that can be created on the template. It has also been demonstrated that the SFIL process is capable of eliminating contaminants from the template (master) during a step and repeat imprinting process. The low pressure, room temperature nature of SFIL and the transparent imprint templates make it particularly attractive for high-resolution layer-to-layer alignment. Another aspect of SFIL that assists in the layer-to-layer alignment is the presence of a thin layer of low viscosity liquid between the template and wafer prior to UV curing. The liquid maintains a small gap (～0.2 μm) and acts as lubrication and damping agents, which allows for accurate in situ error measurement and compensation. In this paper, we present results from overlay alignment experiments using the SFIL process. A Canon mask aligner was modified to implement a layer-to-layer alignment scheme for SFIL. The objective of this research was to achieve alignment accuracy of about 0.5 ～m, which is the practical limit of the X-Y stage in the mask aligner. The overlay alignment error measurements and the corresponding corrections in X, Y, and Theta were performed using the modified mask aligner. In its current state, the alignment resolution appears to be limited by the resolution of the mask aligner stage. It is expected that other high-resolution alignment techniques that have been developed for optical projection lithography and X-lay lithography processes can be adapted to the SFIL process to significantly improve the alignment resolution.
机译：分步和快速压印光刻（SFIL）工艺是一种低成本，高通量的图案化技术，分辨率低于100 nm。该小组和其他小组的研究表明，压印光刻技术的复制分辨率仅受模板上可创建结构的大小限制。还已经证明，SFIL工艺能够在分步和重复压印过程中从模板（母版）中消除污染物。 SFIL的低压，室温特性和透明的压印模板使其对于高分辨率的层到层对齐特别有吸引力。 SFIL有助于层到层对齐的另一个方面是在UV固化之前，模板和晶圆之间存在一层低粘度液体。液体保持很小的间隙（〜0.2μm），并充当润滑和阻尼剂，从而可以进行精确的原位误差测量和补偿。在本文中，我们介绍了使用SFIL工艺进行的覆盖层对齐实验的结果。佳能掩模对准器被修改以实现SFIL的层到层对准方案。这项研究的目的是要达到约0.5〜m的对准精度，这是掩模对准器中X-Y平台的实际极限。使用修改的掩模对准器执行了覆盖层对准误差测量以及相应的X，Y和Theta校正。在其当前状态下，对齐分辨率似乎受掩模对齐器台的分辨率限制。预期已经为光学投影光刻和X射线平版印刷工艺开发的其他高分辨率对准技术可以适应SFIL工艺，以显着提高对准分辨率。

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