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High Resolution Templates for Step and Flash Imprint Lithography

机译:步进和闪存压印光刻的高分辨率模板

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摘要

Step and Flash Imprint Lithography (SFIL) is an attractive method for printing sub-100 nm geometries. Relative to other imprinting processes SFIL has the advantage that the template is transparent, thereby facilitating conventional overlay techniques. In addition, the imprint process is performed at low pressures and room temperature, minimizing magnification and distortion errors. The purpose of this work was to investigate alternative methods for defining high resolution SFIL templates and study the limits of the SFIL process. Two methods for fabricating templates were considered. The first method used a very thin (< 20 nm) layer of Cr as a hard mask. The second fabrication scheme attempts to address some of the weaknesses associated with a solid glass substrate. Because there is no conductive layer on the final template, SEM and defect inspection are compromised. By incorporating a conductive and transparent layer of indium tin oxide (ITO) on the glass substrate, charging is suppressed during SEM inspection, and the transparent nature of the final template is not affected. Using ZEP-520 as the electron beam imaging resist, features as small as 20 nm were resolved on the templates. Features were also successfully imprinted using both types of templates.
机译:分步和快速压印光刻(SFIL)是一种用于打印100 nm以下几何形状的有吸引力的方法。相对于其他压印过程,SFIL的优势在于模板是透明的,从而有助于传统的覆盖技术。另外,压印过程在低压和室温下执行,从而最大程度地减小了放大率和变形误差。这项工作的目的是研究定义高分辨率SFIL模板的替代方法,并研究SFIL过程的局限性。考虑了两种制造模板的方法。第一种方法使用非常薄(<20 nm)的Cr层作为硬掩模。第二种制造方案试图解决与固体玻璃基板相关的一些弱点。由于最终模板上没有导电层,因此扫描电镜和缺陷检查会受到影响。通过在玻璃基板上加入导电和透明的铟锡氧化物(ITO)层,可以在SEM检查期间抑制充电,并且不会影响最终模板的透明性。使用ZEP-520作为电子束成像抗蚀剂,可以在模板上分辨出小至20 nm的特征。使用这两种类型的模板也成功地印上了特征。

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