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首页> 外文会议>Conference on Emerging Lithographic Technologies VIII pt.2; 20040224-20040226; Santa Clara,CA; US >Controlling template response during imprint lithography
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Controlling template response during imprint lithography

机译：在压印光刻过程中控制模板响应

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摘要

Step-and-Flash Imprint Lithography (S-FIL~(TM)) is a principal candidate for the next-generation lithography at the 45-nm node (and below). In imprint lithography, a monomer solution is dispensed onto the wafer. The monomer fills small features in a template that is lowered onto the wafer. The monomer is cured, causing it to solidify so that a three-dimensional replica of the template features is produced and remains on the wafer after the template is removed. Because this is a one-to-one process, any distortions of the template during the squeezing process will be manifested directly as errors in the features that are imprinted on the substrate. A finite element (FE) structural model of the S-FIL template has been created to predict the distortions due to mounting, gravity, and the fluid pressure distribution that arises from the viscous flow of the polymer liquid during the imprint process. Distortions take the form of both in-plane and out-of-plane displacements. An axisymmetric, finite difference (FD) model is used to predict the pressure distribution over the template due to viscous flow and surface tension effects. The FE and FD models are coupled using an iterative process in which the pressure distribution and template distortions are calculated at progressing time intervals until the final, desired gap height is achieved, nominally 200 nm. The coupled models are capable of characterizing the fluid-structure interaction that occurs during the imprint process. The results of the model will facilitate the design of system components that are capable of meeting the stringent error budgets associated with the sub-45-nm nodes.
机译：步进闪光压印光刻技术（S-FILTM）是45纳米节点（及以下）的下一代光刻技术的主要候选对象。在压印光刻中，将单体溶液分配到晶片上。单体填充模板中的小部件，模板降到晶片上。单体被固化，使其固化，从而产生了模板特征的三维复制品，并在去除模板后保留在晶片上。因为这是一对一的过程，所以在挤压过程中模板的任何变形都将直接显示为压印在基材上的特征中的错误。已经创建了S-FIL模板的有限元（FE）结构模型，以预测由于压印过程中聚合物液体的粘滞流动引起的安装，重力和流体压力分布所引起的变形。变形采取平面内和平面外位移的形式。轴对称有限差分（FD）模型用于预测由于粘性流动和表面张力效应而导致的模板上的压力分布。 FE和FD模型使用迭代过程进行耦合，其中以递增的时间间隔计算压力分布和模板变形，直到达到最终的所需间隙高度（标称值为200 nm）为止。耦合的模型能够表征在压印过程中发生的流体-结构相互作用。该模型的结果将有助于系统组件的设计，这些组件能够满足与45纳米以下节点相关的严格误差预算。

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