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首页> 外文会议>Conference on High-Resolution Wavefront Control: Methods, Devices, and Applications IV, Jul 8-9, 2002, Seattle, Washington, USA >Low-cost technological approaches to micromachined spatial light modulators
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Low-cost technological approaches to micromachined spatial light modulators

机译：用于微机械空间光调制器的低成本技术方法

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摘要

Approaches toward the fabrication of low-cost integrated micromachined spatial light modulators are presented. An optimized fabrication procedure minimizes requirements on integrated electronics and mechanical layers. This surface can rest on a viscoelastic carrier material under which an electrode array is placed. Under application of appropriate potentials on the underlying electrodes, localized sinusoidal phase gratings can be produced. The depth of modulation can be converted to an intensity value by using Schlieren bars and integrating properties of the projection lens. The pixel sizes can vary from 20 μm to 1mm. In the fabrication procedure, a top chip is used, which is coated with a 50nm nitride layer and an 80nm Al layer. A droplet of the carrier layer is placed on the bottom chip, on which the top chip is then pressed, planarizing the surface. A 33 wt% KOH solution is used to bulk-etch the silicon of the top chip, using the thin nitride membrane as an etch stop, thus transferring the metal layer to the carrier substrate, a technique potentially also usable for adaptive deformable mirrors. A special elastomer based etch holder technology was developed to provide low stress protection of the sidewalls and aluminum bond pads during etching. Applications of these devices lie in the field of projection displays, optical lithography and optical communication networks.
机译：提出了制造低成本集成微机械空间光调制器的方法。优化的制造程序可将对集成电子和机械层的要求降至最低。该表面可以搁置在粘弹性载体材料上，在该弹性材料上放置电极阵列。在下面的电极上施加适当的电势时，可以产生局部正弦相位光栅。可以通过使用Schlieren条和对投影透镜的属性进行积分将调制深度转换为强度值。像素大小可以从20微米到1毫米不等。在制造过程中，使用顶部芯片，该顶部芯片涂覆有50nm的氮化物层和80nm的Al层。将一滴载体层的液滴放在底部芯片上，然后将顶部芯片压在其上，使表面平坦化。使用33重量％的KOH溶液，使用氮化硅薄膜作为蚀刻停止层，对顶部芯片的硅进行整体蚀刻，从而将金属层转移到载体基板上，该技术也可能适用于自适应可变形反射镜。开发了一种基于弹性体的特殊蚀刻支架技术，以在蚀刻过程中为侧壁和铝焊盘提供低应力保护。这些设备的应用位于投影显示器，光学光刻和光通信网络领域。

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