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首页> 外文会议>Conference on Nanoparticles 2004: Nanoelectronics, Nanophotonics, and Nanomagnetics vol.7; 20041025-26; Stamford,CT(US) >COMPUTING AND SENSORS: NANOMATERIAL OPPORTUNITIES AND CHALLENGES IN FUTURE INTEGRATED CIRCUIT TECHNOLOGY
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COMPUTING AND SENSORS: NANOMATERIAL OPPORTUNITIES AND CHALLENGES IN FUTURE INTEGRATED CIRCUIT TECHNOLOGY

机译：计算机与传感器：未来集成电路技术的纳米材料机遇与挑战

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摘要

Integrated circuit manufacturing technology has been producing circuits with minimum feature size less than 100nm since the year 2000 and entered the era of Nanotechnology at that time. This industry introduces a new manufacturing technology every two years with feature sizes reduced by 30% which increases density by 2X with each generation, Moore's Law. Chau has shown that transistors for integrated circuits can continue to shrink below 10nm in size and operate effectively which should support technologies beyond 2011, but many materials will need to be replaced or improved for the manufacturing technologies. Nano-structured materials may have opportunities to provide material solutions for the integrated circuit technology and also package technologies; however there are significant challenges for these materials to be used in these applications.
机译：自2000年以来，集成电路制造技术一直在生产最小特征尺寸小于100nm的电路，并进入了纳米技术时代。该行业每两年引入一种新的制造技术，其特征尺寸减小30％，每代产品的密度就会增加2倍，这就是摩尔定律。 Chau表示，集成电路晶体管可以继续缩小至10nm以下，并有效运行，这将支持2011年以后的技术，但是制造技术将需要替换或改进许多材料。纳米结构材料可能有机会为集成电路技术以及封装技术提供材料解决方案；然而，在这些应用中使用这些材料存在很大的挑战。

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