首页> 外文会议>Conference on Optical Micro- and Nanometrology in Manufacturing Technology; 20040429-20040430; Strasbourg; FR >Thickness measurement of thin transparent plates with a broad-band wavelength scanning interferometer
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Thickness measurement of thin transparent plates with a broad-band wavelength scanning interferometer

机译:用宽带波长扫描干涉仪测量透明薄板的厚度

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A novel broad-band telecom laser source is used to realize a lateral-shear scanning-wavelength interferometer for measuring the thickness of thin plates. We show that the wide tunability range allows to detect samples down to tens of microns with a relative uncertainty of less than 0.5% and a resolution of about 1 nm. A comparable accuracy in the thickness characterization of double-layer structures is also demonstrated. In turn, the wide tunability range needs the dispersion law of the materials to be taken into account in the model for correct thickness evaluation.
机译:一种新型的宽带电信激光源被用于实现用于测量薄板厚度的横向剪切扫描波长干涉仪。我们表明,宽的可调范围允许检测低至数十微米的样品,相对不确定度小于0.5%,分辨率约为1 nm。还证明了在双层结构的厚度表征中可比较的精度。反过来,宽的可调范围需要在模型中考虑材料的色散定律,以进行正确的厚度评估。

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