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首页> 外文会议>Conference on Optical Microlithography XV Pt.2, Mar 5-8, 2002, Santa Clara, USA >OPC applications into embedded-OPC designs
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OPC applications into embedded-OPC designs

机译：将OPC应用程序集成到嵌入式OPC设计中

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摘要

To achieve the demand of the ever-shrinking technologies, design engineers are embedding rule-based OPC (Optical Proximity Correction) or hand-applied OPC into bit-cell libraries. These libraries are then used to generate other components on a chip. This creates problems for the end users, the photolithographers. Should the photolithographer change the process used to generate the simulations for the embedded OPC, the process can become unstable. The temptation to optimize these shrinking cells with embedded adjustments can be overcome by other methods. Manually increasing fragmentation or manually freezing portions of bit cells can provide the same level of accuracy as a well-simulated embedded solution, so now the model-base OPC generated by the end user can be applied, tolerating process or illumination changes. Manually freezing portions of a bit cell can assist in optimization by blocking larger features from receiving a model-based solution, whereas increased fragmentation augments the model-based application. Freezing contacts or local interconnects landing sites at poly for example, would allow the model-based OPC to optimize the poly over the active regions where transistor performance is vital. This paper documents the problems seen with embedding OPC and the proper ways to resolve them. It will provide insight into embedded OPC removal and replacement. Simulations and empirical data document the differences seen between embedded-OPC bit cells and fragment-optimized bit cells.
机译：为了满足不断缩小的技术的需求，设计工程师正在将基于规则的OPC（光学邻近校正）或手动应用的OPC嵌入位单元库中。这些库随后用于在芯片上生成其他组件。这给最终用户，光刻者带来了问题。如果光刻师改变用于生成嵌入式OPC仿真的过程，该过程可能会变得不稳定。通过嵌入的调整来优化这些收缩单元的诱惑可以通过其他方法来克服。手动增加碎片或手动冻结部分位单元可以提供与模拟良好的嵌入式解决方案相同的准确性，因此现在可以应用最终用户生成的基于模型的OPC，从而可以承受过程或照明变化。手动冻结位单元的各个部分可以通过阻止较大的功能接收基于模型的解决方案来帮助优化，而增加的碎片化则增加了基于模型的应用程序。例如，冻结多晶硅上的触点或本地互连的着陆点，将允许基于模型的OPC在晶体管性能至关重要的有源区域上优化多晶硅。本文记录了嵌入OPC时遇到的问题以及解决这些问题的正确方法。它将深入了解嵌入式OPC的拆卸和更换。仿真和经验数据记录了嵌入式OPC位单元和片段优化位单元之间的差异。

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