Failure analysis has come to play a key role in ensuring quality and reliability in semiconductor devices, associated packaging and printed wiring boards. Tools are increasingly available to those investigating high-density integrated circuits at the die level, particularly for edit and repair operations. Until recently however, this capability has been limited by the inherent low-resolution mechanical/manual processes used for destructive analysis on electronics packaging. A laser-based tool has been developed to selectively and locally enable access to traces and layers within packages and provide a way to perform edits to an area of interest.
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