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首页> 外文会议>Conference on Photon Processing in Microelectronics and Photonics Jan 21-24, 2002 San Jose, USA >Integrated tool for fabrication of electronic components by laser direct write
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Integrated tool for fabrication of electronic components by laser direct write

机译：通过激光直接写入制造电子元件的集成工具

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摘要

A prototype workstation has been developed that allows the fabrication of passive electronic components at low temperatures using a laser direct-write process. The work station combines a variety of laser processing techniques onto a single, integrated platform. These techniques include material deposition, laser micromachining, laser sintering, and laser trimming. One particular process, referred to as "mill and fill", combines the laser micromachining ability of the tool with "off-the-shelf" conductor pastes to allow the fabrication of high density metallization at very low temperatures (200℃). The present work describes the details of the "mill and fill" process and shows examples of prototype devices fabricated using this technique.
机译：已经开发了原型工作站，该工作站允许使用激光直接写入工艺在低温下制造无源电子组件。该工作站将多种激光加工技术结合到一个集成平台上。这些技术包括材料沉积，激光微加工，激光烧结和激光修整。一种特殊的过程称为“铣削和填充”，将工具的激光微加工能力与“现成的”导体浆料相结合，从而可以在非常低的温度（200℃）下制造高密度金属化层。本工作描述了“研磨和填充”过程的细节，并显示了使用该技术制造的原型设备的示例。

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