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Lithographic Tradeoffs Between Different Assist Feature OPC Design Strategies

机译：不同辅助功能OPC设计策略之间的光刻平衡

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摘要

In recent years many of the problems associated with the use of assist features have been partially or completely resolved. Such issues include mask manufacturing and inspection, software maturity, and the so-called forbidden pitch problem. Still, the lithographer is faced with numerous choices in developing production worthy assist feature designs. This paper will examine some of the choices, and the tradeoffs associated with each. In particular the choice between simple one-dimensional scatter bar designs and various two-dimensional designs will be explored to determine the tradeoffs with lithographic performance. A DRC (Design Rule Check) -driven technique has been developed to highlight potential shortcomings of each individual design strategy. The lithographic impact of these shortcomings has been confirmed with on-Silicon process data.
机译：近年来，与使用辅助功能相关的许多问题已部分或完全解决。这些问题包括掩模制造和检查，软件成熟度以及所谓的禁止间距问题。不过，平版印刷者在开发有价值的辅助功能设计时仍面临众多选择。本文将研究一些选择以及与之相关的权衡。特别地，将探索在简单的一维散布条设计和各种二维设计之间的选择，以确定在光刻性能上的权衡。已经开发出一种由DRC（设计规则检查）驱动的技术，以突出每种单独设计策略的潜在缺点。这些缺陷对光刻的影响已在硅工艺数据中得到证实。

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