Development of MEMS Power Sensor Package

机译：MEMS功率传感器封装的开发

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This paper presents a design and fabrication ofrnadvanced MEMS in high power applications. Therndeveloped MEMS device is used as a high powerrnsensor for detecting high current applications. Werndesigned and fabricated MxN array of low powerrnMEMS switches to handle high power which arernmass actuated by an external magnetic field. Thernarray of MEMS devices has been packaged in arnconventional package and testing was performedrnto validate its operation. The switching time wasrnvery compatible with the existing solid staternswitches with much higher order of power capability.

机译：本文介绍了在高功率应用中先进的MEMS的设计和制造。先进的MEMS器件用作检测高电流应用的高功率传感器。 Wern设计制造的低功耗MEMS开关MxN阵列可处理由外部磁场驱动的高功率。 MEMS器件阵列已被包装在常规封装中，并进行了测试以验证其操作。开关时间与具有更高阶功率能力的现有固态开关完全兼容。

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来源
《Device packaging 2010》|2010年|p.1-3|共3页
会议地点 Scottsdale/Fountain Hills AZ(US)
作者
Bruce C. Kim; Rahim Kasim;
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作者单位

University of AlabamarnElectrical and Computer EngineeringrnTuscaloosa, AL 35487-0286rnbkim@imaps.orgrn(205) 348-4972;

Intel Corporation;

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会议组织
原文格式 PDF
正文语种 eng
中图分类制造工艺;
关键词
MEMS sensor; power distribution;

机译：MEMS传感器;;电力调配;

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2. Development of MEMS Power Sensor Package [J] . Bruce C. Kim, Rahim Kasim Journal of Microelectronics and Electronic Packaging . 2010,第3期

机译：MEMS功率传感器封装的开发
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机译：真空封装低功耗谐振MEMS应变传感器
4. Development of MEMS Power Sensor Package [C] . Bruce C. Kim, Rahim Kasim IMAPS international conference and exhibition on device packaging . 2010

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6. Relative Contributions of Packaging Elements to the Thermal Hysteresis of a MEMS Pressure Sensor [O] . Youssef Hamid, David A. Hutt, David C. Whalley, 2020

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Development of MEMS Power Sensor Package

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