The Use of Metallographic and SEM Analysis for Characterization of Sidewall Surfaces in MEMS Devices with DRIE Processing

著录项

• 来源
  《Device packaging 2010》|2010年|p.1-3|共3页
• 会议地点 Scottsdale/Fountain Hills AZ(US)
• 作者

  Colin Stevens; Robert Dean; Samuel Lawrence; Lee Levine;

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• 作者单位

  Auburn University 200 Broun Hall Auburn, AL 36840 T: (334)-844-1800, F: 334-844-1809 cbs00016@auburn.edu;

  rnAuburn University 200 Broun Hall Auburn, AL 36840 T: (334)-844-1800, F: 334-844-1809 deanron@auburn.edu;

  rnLehigh University Whitaker Laboratories 5 E Packer Avenue Bethlehem, PA 18016 T: (610) 758-4228, sjl208@lehigh.edu;

  rnProcess Solutions Consulting 8009 George Road, New Tripoli, PA 18066 T: (610)-248-2002, F: 484-217-2001 levilr@ptd.net;

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• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类 制造工艺;
• 关键词