The European 3D Technology Platform (e-CUBES)

著录项

• 来源
  《Device packaging 2010》|2010年|p.1-8|共8页
• 会议地点 Scottsdale/Fountain Hills AZ(US)
• 作者

  Peter Ramm; Nicolas Lietaer; Walter De Raedt; Thomas Fritzsch; Thierry Hilt; Pascal Couderc; Christian Val; Alan Mathewson; Kafil M. Razeeb; Frank Stam; Armin Klumpp; Josef Weber; Maaike Taklo;

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• 作者单位

  Fraunhofer IZM-M, Hansastrasse 27d, 80686 Munich, Germany;

  rnSINTEF ICT, Gaustadalléen 23C, 0373 Oslo, Norway;

  rnIMEC-SSET, Kapeldreef 75, 3001, Leuven, Belgium;

  rnFraunhofer IZM, Gustav-Meyer-Allee 25, 13355 Berlin, Germany;

  rnCEA, LETI-MINATEC, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France;

  rn3D-PLUS, 641 rue Hélène Boucher, 78532 Buc, France;

  rn3D-PLUS, 641 rue Hélène Boucher, 78532 Buc, France;

  rnTyndall National Institute, "Lee Maltings" Dyke Parade, Cork, Ireland;

  rnTyndall National Institute, "Lee Maltings" Dyke Parade, Cork, Ireland;

  rnTyndall National Institute, "Lee Maltings" Dyke Parade, Cork, Ireland;

  rnFraunhofer IZM-M, Hansastrasse 27d, 80686 Munich, Germany;

  rnFraunhofer IZM-M, Hansastrasse 27d, 80686 Munich, Germany;

  rnSINTEF ICT, Gaustadalléen 23C, 0373 Oslo, Norway;

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• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类 制造工艺;
• 关键词