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Enabling Wafer Level Processes for CIS Manufacturing

机译：为CIS制造启用晶圆级工艺

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摘要

CMOS (Complimentary Metal Oxide Semiconductor) Image Sensors have becomernubiquitous, appearing in cars, cell phones, toys and various other devices used in everyrnday life. The primary reason for this increasing presence of CIS (CMOS Image Sensors)rnis the continual improvement of the performance to cost ratio of these devices. Thisrnoverall improvement is driven both by improvements in the CIS itself and improvementsrnin how this CIS is incorporated in a camera module. Numerous process developmentsrnrelated to both the electrical and optical aspects of 3D packaging of CIS that havernenabled this climb up the performance vs. cost curve will be reviewed in this paper withrnparticular attention to: (1) Lens molding – The ability to mold lenses, both spherical andrnaspherical at the wafer level as well as make full size master stamps from partial mastersrnfor lens molding. These lenses can be molded on both sides of a wafer and the lensesrnaligned to each other; (2) Aligned wafer bonding for optical interconnects consisting ofrnlens stacks and CIS wafer, to allow the thinning of a CIS for BSI (back side illumination),rnand for electrical interconnects. Together these processes allow the heterogeneousrnintegration of optical and electrical elements at the wafer level and advance the CIS uprnthe performance vs. cost curve.
机译：CMOS（互补金属氧化物半导体）图像传感器已经变得无处不在，出现在汽车，手机，玩具和日常生活中使用的各种其他设备中。 CIS（CMOS图像传感器）日益普及的主要原因是，这些设备的性能/成本比不断提高。总体改进是由CIS本身的改进以及此CIS在相机模块中的集成方式的改进推动的。本文将回顾与CIS的3D封装在电气和光学方面都有关的许多工艺发展，这些发展使性能与成本曲线得以攀升，本文将特别关注以下方面：（1）镜片成型–能够成型球形镜片的能力晶圆级的球形，并从部分母版制作全尺寸的母版以进行透镜成型。这些透镜可以模制在晶片的两面，并且透镜可以彼此对准。 （2）对齐的晶圆键合，用于由透镜堆叠和CIS晶片组成的光学互连，以使用于BSI（背面照明）的CIS和电气互连的CIS变薄。这些过程共同使光和电元件在晶片级上异质集成，并提高了CIS的性能-成本曲线。

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  • 来源
    《Device packaging 2010》|2010年|p.1-6|共6页
  • 会议地点 Scottsdale/Fountain Hills AZ(US)
  • 作者

    E. Pabo; P. Lindner; G. Oakes; R. Miller; rnG Kreindl; T Matthias; V Dragoi; M Wimplinger;

  • 作者单位

    EV Group Inc, 7700 South River Parkway, Tempe, AZ 85284, U.S.A.;

    EV Group, DI E. Thallner Strasse 1, 4782 St. Florian am Inn, Austria;

    EV Group Inc, 7700 South River Parkway, Tempe, AZ 85284, U.S.A.;

    EV Group Inc, 7700 South River Parkway, Tempe, AZ 85284, U.S.A.;

    EV Group, DI E. Thallner Strasse 1, 4782 St. Florian am Inn, Austria;

    EV Group, DI E. Thallner Strasse 1, 4782 St. Florian am Inn, Austria;

    EV Group, DI E. Thallner Strasse 1, 4782 St. Florian am Inn, Austria;

    EV Group, DI E. Thallner Strasse 1, 4782 St. Florian am Inn, Austria;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 制造工艺;
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