首页> 外文会议>Device packaging 2010 >Die-to-Wafer Bonding of Thin Dies using a 2-Step Approach; High Accuracy Placement, then Gang Bonding

【24h】

Die-to-Wafer Bonding of Thin Dies using a 2-Step Approach; High Accuracy Placement, then Gang Bonding

机译：使用两步法将薄晶粒进行晶片对晶片的键合；高精度贴装，然后进行邦定键合

获取原文

获取原文并翻译 | 示例

页面导航

摘要
著录项
相似文献
相关主题

摘要

25 um thick dies, mounted on thick carrier die, were placed on a 300mm landing wafer using thernHigh Accuracy Die Bonder SET-FC300. The bonding process was either Cu/Cu or Cu/Sn withrnrespective pitch of 10μm and 40μm. A special test structure was designed on the landing die tornelectrically determine the alignment accuracy after bonding - both with respect to the X-Yrnalignment and the rotation. Stacks were then assembled by collective hybrid bonding process.rnThe top die is aligned and placed on the landing wafer coverer by a patterned polymer acting as arntemporary alignment holder, and then the populated wafer is moved to a wafer bonder where allrnthe dies are collectively bonded. Electrical measurements on the alignment structures indicaternthat maximum misalignment of the TSV to the landing pad is in the range of 1.5-1.75 um and thernmaximum rotation of the die is 0.03 degrees.

机译：使用高精度芯片键合机SET-FC300将25 um厚的芯片（安装在较厚的载体芯片上）放置在300mm着陆晶片上。焊接工艺为Cu / Cu或Cu / Sn，间距分别为10μm和40μm。在着陆模上设计了一种特殊的测试结构，以电方式确定粘结后的对准精度-相对于X-Y对准和旋转。然后通过集体混合键合工艺组装堆叠.rn将顶部芯片对准并通过用作临时对准支架的图案化聚合物放置在着陆晶圆覆盖器上，然后将填充的晶圆移动到晶圆粘结机中，在这里将所有芯片共同粘结。对准结构上的电学测量表明，TSV到着陆焊盘的最大未对准范围为1.5-1.75 um，并且芯片的最大旋转为0.03度。

著录项

来源
《Device packaging 2010》|2010年|p.1|共1页
会议地点 Scottsdale/Fountain Hills AZ(US)
作者
Gilbert Lecarpentier; Rahul Agarwal; Wenqi Zhang; Paresh Limaye; Riet Labie; A.Phommahaxay; P. Soussan;
展开▼
作者单位

SET (Smart Equipment Technology) 131, Impasse Barteudet - BP24rnSaint Jeoire, Haute Savoie 74490 FRANCE P: +33- 450 35 38 03 E: glecarpentier@set-sas.fr;

rnSET (Smart Equipment Technology) 131, Impasse Barteudet - BP24rnSaint Jeoire, Haute Savoie 74490 FRANCE;

SET (Smart Equipment Technology) 131, Impasse Barteudet - BP24rnSaint Jeoire, Haute Savoie 74490 FRANCE;

SET (Smart Equipment Technology) 131, Impasse Barteudet - BP24rnSaint Jeoire, Haute Savoie 74490 FRANCE;

SET (Smart Equipment Technology) 131, Impasse Barteudet - BP24rnSaint Jeoire, Haute Savoie 74490 FRANCE;

SET (Smart Equipment Technology) 131, Impasse Barteudet - BP24rnSaint Jeoire, Haute Savoie 74490 FRANCE;

rnIMECrn131, Impasse Barteudet - BP24rnSaint Jeoire, Haute Savoie 74490rnFRANCE;

展开▼
会议组织
原文格式 PDF
正文语种 eng
中图分类制造工艺;
关键词

相似文献

外文文献
中文文献
专利

1. Microtensile bond strength of a total-etch 3-step, total-etch 2-step, self-etch 2-step, and a self-etch 1-step dentin bonding system through 15-month water storage. [J] . Armstrong SR, Vargas MA, Fang Q, The journal of adhesive dentistry . 2003,第1期

机译：全蚀刻3步，全蚀刻2步，自蚀刻2步和自蚀刻1步牙本质粘合系统的微拉伸粘合强度，可储存15个月的水。
2. Lanthanoid antimonides Ln(2)Sb(5) (Ln = Sm, Gd, Tb, Dy) and rationalization of chemical bonding within the antimony polyanion by combining the Zintl-Klemm concept with bond-length bond-strength relationships [J] . Jeitschko W., Schelk M., Rodewald UC., Zeitschrift fur Anorganische und Allgemeine Chemie . 2001,第8期

机译：镧系元素锑化物Ln（2）Sb（5）（Ln = Sm，Gd，Tb，Dy）和通过结合Zintl-Klemm概念和键长键强度关系使锑聚阴离子内的化学键合合理化
3. Three-dimensional evaluation of bracket placement accuracy and excess bonding adhesive depending on indirect bonding technique and bracket geometry: an in-vitro study [J] . Stephan Christian M?hlhenrich, Constantin Alexandridis, Florian Peters, Head Face Medicine . 2020,第1期

机译：基于间接粘接技术和支架几何形状的支架放置精度和过量粘合粘合剂的三维评估：体外研究
4. Die-to-Wafer bonding of thin dies using a 2-Step approach; High Accuracy Placement, then Gang Bonding - (PPT) [C] . Rahul Agarwal, Wenqi Zhang, Paresh Limaye, International Conference and Exhibition on Device Packaging . 2010

机译：使用两步方法芯片粘接薄管芯;高精度放置，然后帮合 - （PPT）
5. The mechanical reliability of 1mil Au wire bonds in different bond pad opening shapes, sizes and placement accuracy. [D] . Napoli, Salvatore Thomas. 2014

机译：100万金丝键合在不同焊盘开口形状，尺寸和放置精度下的机械可靠性。
6. Three-dimensional evaluation of bracket placement accuracy and excess bonding adhesive depending on indirect bonding technique and bracket geometry: an in-vitro study [O] . Stephan Christian Möhlhenrich, Constantin Alexandridis, Florian Peters, 2020

机译：基于间接粘接技术和支架几何形状的支架放置精度和过量粘合粘合剂的三维评估：体外研究
7. A die-to-wafer bonding approach to photonics integration (poster) [O] . Roelkens Günther, Van Thourhout Dries, Baets Roel 2007

机译：光子集成的芯片到晶圆键合方法（海报）

Die-to-Wafer Bonding of Thin Dies using a 2-Step Approach; High Accuracy Placement, then Gang Bonding

摘要

著录项

相似文献

相关主题

期刊订阅