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首页> 外文会议>Electronic Components Technology Conference, 1998. 48th IEEE >A relative comparison of PWB warpage due to simulated infrared and wave soldering processes
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A relative comparison of PWB warpage due to simulated infrared and wave soldering processes

机译：模拟红外和波峰焊工艺导致的PWB翘曲的相对比较

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Current trends in the electronic packaging industry are directed at the miniaturization of electronic component size and increasing component density on printed wiring board assemblies (PWBAs). The trend is also towards the manufacture of thin printed wiring boards (PWBs). Developing such technologies creates heightened issues with printed wiring board warpage, which lead to component misregistration during automated component placement and insertion processes. In addition, daily usage may induce PWBA warpage that could lead to further reliability issues such as premature solder joint failures caused by high residual stresses. It is desirable to understand and avoid such problems as redesigns or repairs to reduce excessive warpage is time consuming and costly. Two types of bare, four layer PWB test vehicles were designed and fabricated to replicate simplified versions of typical boards produced by PWB manufacturers. The boards were subjected to simulated infrared and wave soldering reflow processes in a small lab-scale oven integrated with a shadow moire out-of-plane displacement measurement system. The system is capable of on-line measurement of PWB warpage during operational thermal cycling. The highly automated, computer controlled, lab-scale ovens are able to reproduce virtually any given manufacturer's temperature profile. The results presented show the effects that simulated wave and infrared reflow soldering processes have on the warpage of two different PWB designs.
机译：电子封装行业的当前趋势是针对电子元件尺寸的小型化和印刷线路板组件（PWBA）上元件密度的增加。趋势也趋向于制造薄印刷线路板（PWB）。开发此类技术会增加印刷电路板翘曲的严重性，从而导致在自动元件放置和插入过程中元件对准不良。此外，日常使用可能会引起PWBA翘曲，从而可能导致进一步的可靠性问题，例如由高残留应力引起的过早焊点失效。期望理解并避免诸如重新设计或维修以减少过度翘曲的问题是费时且昂贵的。设计和制造了两种类型的裸露，四层PWB测试工具，以复制PWB制造商生产的典型板的简化版本。电路板在一个小型实验室规模的烤箱中进行了模拟的红外和波峰焊回流焊工艺，该烤箱集成了阴影波纹面外位移测量系统。该系统能够在线测量操作热循环过程中的PWB翘曲。高度自动化，计算机控制的实验室规模的烤箱几乎可以复制任何给定制造商的温度曲线。给出的结果表明，模拟波和红外回流焊接工艺对两种不同的PWB设计的翘曲具有影响。

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