A comparison of PWB warpage due to simulated infrared and wave soldering processes

Polsky Y.; Sutherlin W.

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A comparison of PWB warpage due to simulated infrared and wave soldering processes

机译：模拟红外和波峰焊工艺导致的PWB翘曲比较

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Two types of bare, four layer printed wiring board (PWB) test vehicles were designed and fabricated to replicate simplified versions of typical boards produced by PWB manufacturers. The boards were subjected to simulated infrared and wave soldering reflow processes in a small lab-scale oven integrated with a shadow Moire out-of-plane displacement measurement system. The measured warpages were qualitatively and quantitatively analyzed at selected temperatures during the reflow profiles. The results presented compare and contrast the effects that simulated wave and infrared reflow soldering processes have on the warpage of two different PWB designs.

机译：设计和制造了两种类型的裸露的四层印刷线路板（PWB）测试工具，以复制PWB制造商生产的典型板的简化版本。电路板在一个小型实验室规模的烤箱中进行了模拟的红外和波峰焊回流焊工艺，该烤箱集成了阴影莫尔平面外位移测量系统。在回流曲线期间，在选定的温度下对测得的翘曲进行定性和定量分析。给出的结果比较并对比了模拟波和红外回流焊接工艺对两种不同的PWB设计翘曲的影响。

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《IEEE transactions on electronics packaging manufacturing》 |2000年第3期|P.191-199|共9页
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Polsky Y.; Sutherlin W.;
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1. Thermoelastic modeling of a PWB with simulated circuit traces subjected to infrared reflow soldering with experimental validation [J] . Y. Polsky, I. C. Ume Journal of Electronic Materials . 1999,第4期

机译：具有经过红外回流焊接的模拟电路走线的PWB的热弹性建模并具有实验验证
2. Finite element analysis of PWB warpage due to the solder masking process [J] . Ume I.C., Martin T. IEEE transactions on components, packaging, and manufacturing technology. Part A . 1997,第3期

机译：阻焊工艺导致的PWB翘曲的有限元分析
3. Finite element analysis of PWB warpage due to cured solder mask-sensitivity analysis [J] . Ume I.C., Martin T. IEEE transactions on components, packaging, and manufacturing technology. Part A . 1997,第3期

机译：固化阻焊层导致的PWB翘曲的有限元分析
4. A relative comparison of PWB warpage due to simulated infrared and wave soldering processes [C] . Sutherlin, W., Polsky, Electronic Components Technology Conference, 1998. 48th IEEE . 1998

机译：模拟红外和波峰焊工艺导致的PWB翘曲的相对比较
5. Development of a design tool to assist layout/layup design to minimize warpage of a PWB during fabrication and reflow solder processes. [D] . Ahn, Wonkee. 2004

机译：开发设计工具以协助布局/布局设计，以最大程度减少制造和回流焊工艺期间PWB的翘曲。
6. Optimal Dummy Pattern Design Method for PWB Warpage Control Using the Human-Based Genetic Algorithm [O] . Sun Kyoung Kim, Sang-Hyuk Lee 2020

机译：采用人基遗传算法的PWB翘曲控制最优虚设图案设计方法
7. Establishment of Estimate Methods on Impact Strength of Lead-Free Solder Joints in BGA Packages (1) Dependence of Failure Modes of Solder Joints under Impact Load on Strain of PWB [O] . Akihiro Yaguchi, Hisashi Tanie, Yasuhiro Naka, 2010

机译：建立对BGA封装中无铅焊点的影响力的估计方法（1）抗衰式焊接损失模式的依赖性损失载荷株的依赖性损失载荷株对PWB菌株的影响

A comparison of PWB warpage due to simulated infrared and wave soldering processes

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