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首页> 外文期刊>IEEE transactions on components, packaging, and manufacturing technology. Part A >Finite element analysis of PWB warpage due to cured solder mask-sensitivity analysis
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Finite element analysis of PWB warpage due to cured solder mask-sensitivity analysis

机译：固化阻焊层导致的PWB翘曲的有限元分析

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摘要

This paper describes the impact of different types of cured solder mask and mask thicknesses on printed wiring board (PWB) warpage. Finite element analysis (FEA) was used to study the sensitivity of board warpage to changes in the mask material properties (different types of solder mask), and to variations in mask thickness. The sensitivity analysis of the influence of cured solder mask and variations in mask thickness on PWB warpage are the focus of this paper. The study reported in this paper was carried out with four different board designs, and the results are presented here. The results of these analyses have resulted in general guidelines which should be observed when selecting masking materials.
机译：本文介绍了不同类型的固化阻焊剂和掩膜厚度对印刷线路板（PWB）翘曲的影响。有限元分析（FEA）用于研究板翘曲对掩模材料特性（不同类型的阻焊剂）变化以及掩模厚度变化的敏感性。本文的重点是对固化的阻焊膜的影响以及掩膜板厚度变化对PWB翘曲的敏感性进行分析。本文报道的研究是使用四种不同的电路板设计进行的，结果在此处显示。这些分析的结果形成了通用准则，选择掩蔽材料时应遵守这些准则。

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