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首页> 外文期刊>IEEE transactions on components, packaging, and manufacturing technology. Part A >Finite element analysis of PWB warpage due to the solder masking process
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Finite element analysis of PWB warpage due to the solder masking process

机译：阻焊工艺导致的PWB翘曲的有限元分析

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Researchers have begun to examine the various manufacturing processes that a printed wiring board (PWB) undergoes during its production, such as lamination, solder masking, and soldering process to determine their impact on board warpage. The goal of this paper is to determine effects of the solder masking process on the PWB warpage. Finite element analysis was used to study the effects of the solder masking process, in particular the curtain coating and curing processes on PWB warpage of four different board designs. These analyses have aided development of general guidelines that should be observed when selecting solder masking material.
机译：研究人员已经开始研究印刷线路板（PWB）在其生产过程中所经历的各种制造过程，例如层压，阻焊和焊接工艺，以确定它们对板翘曲的影响。本文的目的是确定阻焊层工艺对PWB翘曲的影响。有限元分析用于研究阻焊工艺，尤其是幕涂和固化工艺对四种不同电路板设计的PWB翘曲的影响。这些分析有助于制定通用准则，在选择阻焊材料时应遵守这些准则。

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