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首页> 外文会议>Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV >Advances in focused ion-beam repair of opaque defects
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Advances in focused ion-beam repair of opaque defects

机译：聚焦离子束修复不透明缺陷的研究进展

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Abstract: Repair of photomasks by sputter removal of chrome and other opaque materials with a focused ion beam (FIB) of gallium results in the implantation of gallium and chrome ions into the quartz substrate. The effect is localized transmission loss in the regions where material was removed. Currently, these gallium and chrome `stains' are removed using blanket etching techniques of the complete quartz substrate, thereby restoring the transmission losses. However, these techniques are unacceptable for use with phase shift masks (PSMs). This paper describes a technique that was developed to restore the localized transmission losses to acceptable levels in situ at the FIB repair system. In particular, the development of a technique that restores transmission for i-line lithography phase shift masks for 0.50 $mu@m and 0.35 $mu@m technology requirements is described. Information is presented describing various applications of the process including etched glass and embedded shifter type phase shift photomasks. !3
机译：摘要：通过用聚焦的离子束（FIB）溅射去除铬和其他不透明材料来修复光掩模，会导致镓和铬离子注入到石英基板中。结果是在材料被去除的区域中局部传输损耗。目前，这些镓和铬的“污点”是使用整个石英基板​​的毯式蚀刻技术去除的，从而恢复了传输损耗。但是，这些技术不能与相移掩模（PSM）一起使用。本文介绍了一种将FIB维修系统上的本地传输损耗恢复到可接受水平的技术。特别地，描述了一种技术的发展，该技术针对0.50μm和0.35μm的技术要求恢复用于i线光刻相移掩模的透射。提供的信息描述了该工艺的各种应用，包括蚀刻玻璃和嵌入式移位器型相移光掩模。 ！3

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