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首页> 外文会议>Electronic Packaging Technology amp; High Density Packaging, 2009. ICEPT-HDP '09 >Advanced Moisture Diffusion Model and Hygro-Thermo-Mechanical Design for Flip Chip BGA Package
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Advanced Moisture Diffusion Model and Hygro-Thermo-Mechanical Design for Flip Chip BGA Package

机译：倒装芯片BGA封装的高级水分扩散模型和湿热机械设计

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摘要

In the present paper, a comprehensive moisture diffusion model and characterization for encapsulated plastic Flip Chip (FC) Ball Grid Array (BGA) package are investigated. The transient moisture diffusion analysis described by Fick's second law is performed to evaluate the overall moisture distribution. Diffusivities in the moisture desorption model are determined under Arrhenius behaviors. Hygroscopic swelling properties of polymeric materials are characterized by using an existing TMA/TGA extraction method. With the so-called"thermal-wetness" analogous technique, finite element analysis (FEA) is developed to evaluate the entire moisture distribution on FC BGA package. The analytical expression for total expansion strain due to hygro-thermo-mechanical coupled effect is implemented using finite element software ANSYS. Finite element predictions reveal the significance of contribution of hygroswelling induced strain. Reliability analysis for FC BGA is performed in accordance with JEDEC standard JESD22-A120.A series of comprehensive experimental works and parametric studies are conducted in this research.
机译：本文研究了封装的塑料倒装芯片球栅阵列（BGA）封装的综合水分扩散模型和特性。进行了Fick第二定律描述的瞬态水分扩散分析，以评估总体水分分布。水分解吸模型中的扩散率是根据Arrhenius行为确定的。聚合材料的吸湿膨胀特性通过使用现有的TMA / TGA提取方法来表征。利用所谓的“热湿”类似技术，开发了有限元分析（FEA）来评估FC BGA封装上的整个水分分布。利用有限元软件ANSYS实现了由湿热机械耦合作用引起的总膨胀应变的解析表达式。有限元预测揭示了湿胀引起的应变的重要性。 FC BGA的可靠性分析是根据JEDEC标准JESD22-A120进行的。本研究进行了一系列全面的实验工作和参数研究。

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  • 会议地点 Beijing(CN)
  • 作者

    Ming-Han Tsai; Feng-Jui Hsu; Meng-Chieh Weng; Hsiang-Chen Hsu;

  • 作者单位

    Department of Mechanical and Automation Engineering, I-Shou UniversityNo. 1, Sec. 1, Syuecheng Rd., Dashu Township, Kaohsiung County, Taiwan 84008;

    Department of Mechanical and Automation Engineering, I-Shou UniversityNo. 1, Sec. 1, Syuecheng Rd., Dashu Township, Kaohsiung County, Taiwan 84008;

    Department of Mechanical and Automation Engineering, I-Shou UniversityNo. 1, Sec. 1, Syuecheng Rd., Dashu Township, Kaohsiung County, Taiwan 84008;

    Department of Mechanical and Automation Engineering, I-Shou UniversityNo. 1, Sec. 1, Syuecheng Rd., Dashu Township, Kaohsiung County, Taiwan 84008;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 包装工程;
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