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首页> 外文会议>Electronic Packaging Technology amp; High Density Packaging, 2009. ICEPT-HDP '09 >The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder
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The Effect of Thermal Cycling on Nanoparticle Reinforced Composite Lead-free Solder

机译：热循环对纳米颗粒增强复合无铅焊料的影响

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摘要

The effects of thermal cycling on shear strength and fracture mode of the nanosized Sn-3.0Ag-0.5Cu particulates reinforced Sn-58Bi composite solder were investigated in this paper. By using a self developed top-down method named Consumable-electrode Direct Current Arc technique, the Sn-3.0Ag-0.5Cu nanoparticles were successfully manufactured. The primary particle size of Sn-3.0Ag-0.5Cu nanoparticles ranged from 20nm to 80nm. Sn-3.0Ag-0.5Cu nanoparticles with different weight percentages were mixed into commercial Sn-58Bi solder paste in order to develop a composite solder paste which is lead-free and possess high strength and low melting point. Following the conventional surface-mount technology process, the 1206 chip resistor and ENIG/Cu pad were joined by the composite solder. Scanning electron microscope, transmission electron microscope and optical microscope were employed to observe the morphology of nanoparticles, microstructure of solder matrix, fracture mode after shear test and crack after thermal cycling. The experimental results indicated that before thermal cycling all composite solders'shear strength increased greatly compared to Sn-58Bi solder making them comparable to Sn-3.0Ag-0.5Cu solder. The fracture surfaces of all composite solder joints occurred at the interface between the solder matrix and the resistor termination. After thermal cycling, the shear strength of the composite solders was at a constant value. However, when the weight percentages of Sn-3.0Ag-0.5Cu nanoparticles exceeded a certain value, the shear strength of composite solder joints decreased rapidly and the case of solder brittle fracture increased as the nanoparticles content increased.
机译：研究了热循环对Sn-3.0Ag-0.5Cu纳米颗粒增强Sn-58Bi复合焊料剪切强度和断裂模式的影响。通过使用自行开发的自顶向下方法（称为消耗电极直流电弧技术），成功制造了Sn-3.0Ag-0.5Cu纳米颗粒。 Sn-3.0Ag-0.5Cu纳米粒子的初级粒径为20nm至80nm。将不同重量百分比的Sn-3.0Ag-0.5Cu纳米颗粒混合到商品化的Sn-58Bi焊膏中，以开发出无铅，强度高且熔点低的复合焊膏。按照常规的表面贴装技术工艺，通过复合焊料将1206芯片电阻器和ENIG / Cu焊盘连接在一起。采用扫描电子显微镜，透射电子显微镜和光学显微镜观察纳米颗粒的形貌，焊料基体的微观结构，剪切试验后的断裂方式和热循环后的裂纹。实验结果表明，与Sn-58Bi焊料相比，在热循环前所有复合焊料的剪切强度均大大提高，使其可与Sn-3.0Ag-0.5Cu焊料媲美。所有复合焊点的断裂表面都发生在焊料基体和电阻器终端之间的界面处。在热循环之后，复合焊料的剪切强度为恒定值。然而，当Sn-3.0Ag-0.5Cu纳米粒子的重量百分比超过一定值时，随着纳米粒子含量的增加，复合焊点的剪切强度迅速下降，焊锡脆性断裂的情况增加。

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  • 会议地点 Beijing(CN)
  • 作者

    Si Chen; Zhaonian Cheng; Johan Liu; Yulai Gao; Qijie Zhai;

  • 作者单位

    Key Laboratory of Advanced Display and System Applications SMIT Center, School of Automation and Mechanical Engineering,Shanghai University, No. 149 Yanchang Road, Shanghai 200072, P.R. China;

    SMIT Center Bionano Systems Laboratory, Department of Microtechnology and Nanoscience,Chalmers University of Technology, SE-412 96 Goteborg, Sweden;

    Key Laboratory of Advanced Display and System Applications SMIT Center, School of Automation and Mechanical Engineering,Shanghai University, No. 149 Yanchang Road, Shanghai 200072, P.R. China SMIT Center Bionano Systems Laboratory, Department of;

    School of Materials Science and Engineering, Shanghai University, No. 149 Yanchang Road, Shanghai 200072, P.R. China;

    School of Materials Science and Engineering, Shanghai University, No. 149 Yanchang Road, Sh;

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  • 正文语种 eng
  • 中图分类 包装工程;
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