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首页> 外文会议>Electronic Packaging Technology amp; High Density Packaging, 2009. ICEPT-HDP '09 >Effects of PCB Dynamic Responses on Solder Joint Stress
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Effects of PCB Dynamic Responses on Solder Joint Stress

机译：PCB动态响应对焊点应力的影响

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摘要

The reliability of board level electronic package subjected to drop impact loadings is one of the most concerned issues. In this paper, a standard board level drop impact test was modeled as double cantilever beam model. The deflection and curvature of the Printed Circuit Board (PCB) and the component were compared with that derived from static analysis in order to understand the influence of dynamic response of the PCB on the solder joints. The results show that the difference of flexibility between the PCB and the package is the main driver for solder joint stress; the dynamic response of the PCB observably affects the stress in solder joints.
机译：承受跌落冲击载荷的板级电子封装的可靠性是最受关注的问题之一。在本文中，标准的板级跌落冲击测试被建模为双悬臂梁模型。为了了解印刷电路板（PCB）动态响应对焊点的影响，将印刷电路板（PCB）及其部件的挠度和曲率与静态分析得出的挠度和曲率进行了比较。结果表明，PCB和封装之间柔性的差异是造成焊点应力的主要因素。 PCB的动态响应明显地影响了焊点中的应力。

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