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首页> 外文会议>Electronic Packaging Technology amp; High Density Packaging, 2009. ICEPT-HDP '09 >Development of a Novel Cost-Effective Package-on-Package (PoP) Solution
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Development of a Novel Cost-Effective Package-on-Package (PoP) Solution

机译：新型具有成本效益的层叠封装（PoP）解决方案的开发

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摘要

Package-on-Package (PoP) is one of the major 3D packaging approaches. It vertically combines discrete memory and logic Ball Grid Array (BGA) packages, where one package rests on the top of another. Recently, PoP technologies have attracted more interests, especially for portable electronics related products and applications. For the existing PoP solutions, they have the following disadvantages: As the next-generation PoP module incorporates more features, top package requires more memory inside and finer pitch is needed. Finer pitch of top package will translate into lower stand-off height between top and bottom packages. It means the mold cap of the bottom package should be kept as thin as possible. The logic function of the bottom package will be expanded with two stacked dies. The mold cap of the bottom package should be thicker than that of the original design which has only one die inside. It causes the conflict between the stand-off height issue and expanded logic functionality. The bottom package is a Plastic Ball Grid Array (PBGA) package format normally. Due to its partial mold-cap design, the package's warpage could be large especially non-uniform on a panel since the structure is not well balanced. The bottom package with customized mold chase with the top pin gate molding method has the high cost issue. To solve the above disadvantages, ASTRI has developed a new PoP structure, which employs a new bottom package that is over molded Fine-pitch Ball Gird Array (FBGA) format with mechanically balanced package structure. For the top package, it's a commercial FBGA format with two die stacking inside. Since the new bottom package structure is based on an existing FBGA format, the mold chase is independent of the mold cap and size of the bottom PoP package. The final mold layer for bottom package has a thickness of 0.5mm. The top interface of the bottom PoP package has 136 pads with 0.65mm pitch and a two-row peripheral format, while the bottom interface has 272 pads with 0.65mm pitch and a fourrow peripheral format. The size of both top and bottom packages is 14×14mm2. The configuration of the package is evaluated by scanning electron microscopy (SEM), which shows a favorable interconnection structure. The warpage of the bottom PoP package after assembly process is characterized by shadow moiré system. The warpage is well controlled by adopting the fully molded structure. The average value is around 30μm that is well below the warpage target of 80μm widely used in the industry.
机译：层叠封装（PoP）是主要的3D封装方法之一。它垂直组合了离散存储器和逻辑球栅阵列（BGA）封装，其中一个封装位于另一个封装的顶部。最近，PoP技术吸引了更多兴趣，尤其是在便携式电子相关产品和应用方面。对于现有的PoP解决方案，它们具有以下缺点：由于下一代PoP模块具有更多功能，因此顶部封装需要更多的内部存储器，并且需要更小的间距。顶部包装的间距越小，顶部和底部包装之间的支撑距离就越低。这意味着底部包装的模具盖应保持尽可能薄。底部封装的逻辑功能将通过两个堆叠的芯片进行扩展。底部包装的模具盖应比内部仅具有一个模具的原始设计的模具盖厚。它导致隔离高度问题和扩展的逻辑功能之间的冲突。底部封装通常是塑料球栅阵列（PBGA）封装格式。由于其部分模具盖设计，包装的翘曲可能很大，特别是在面板上的翘曲不大，因为结构没有很好地平衡。具有顶部销钉浇口模制方法的定制模具追赶的底部封装具有高成本问题。为解决上述缺点，应科院开发了一种新的PoP结构，该结构采用了一种新的底部封装，该封装采用具有机械平衡封装结构的超模制细间距球栅阵列（FBGA）格式。对于顶级封装，它是一种商业FBGA格式，内部有两个裸片堆叠。由于新的底部封装结构基于现有的FBGA格式，因此模具追赶与底部PoP封装的模具盖和尺寸无关。底部包装的最终模具层的厚度为0.5mm。底部PoP封装的顶部接口具有136个焊盘，间距为0.65mm，具有两行外围格式；而底部接口则具有272个焊盘，其间距为0.65mm，具有四行外围格式。顶部和底部封装的尺寸均为14×14mm2。封装的结构通过扫描电子显微镜（SEM）进行评估，显示出良好的互连结构。底部PoP封装在组装后的翘曲具有阴影波纹系统的特点。通过采用完全成型的结构，可以很好地控制翘曲。平均值约为30μm，远低于业界广泛使用的80μm的翘曲目标。

著录项

  • 来源
  • 会议地点 Beijing(CN)
  • 作者

    P. SUN; V. C. K. LEUNG; D. YANG; D. X. Q. SHI;

  • 作者单位

    Hong Kong Applied Science Technology Research Institute (ASTRI)2 Science Park East Avenue, Hong Kong Science Park, Shatin, New Territories, Hong Kong, China;

    Hong Kong Applied Science Technology Research Institute (ASTRI)2 Science Park East Avenue, Hong Kong Science Park, Shatin, New Territories, Hong Kong, China;

    Hong Kong Applied Science Technology Research Institute (ASTRI)2 Science Park East Avenue, Hong Kong Science Park, Shatin, New Territories, Hong Kong, China;

    Hong Kong Applied Science Technology Research Institute (ASTRI) 2 Science Park East Avenue, Hong Kong Science Park, Shatin, New Territories, Hong Kong, China;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 包装工程;
  • 关键词

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