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首页> 外文会议>Electronic Packaging Technology amp; High Density Packaging, 2009. ICEPT-HDP '09 >Localized Induction Heating for Wafer Level Packaging
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Localized Induction Heating for Wafer Level Packaging

机译：晶圆级封装的局部感应加热

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摘要

Localized induction heating for wafer level packaging is discussed. This paper is to investigate the relationships between the geometry of solder loop and temperature distribution in induction heating. Using finite element method (FEM) and IR thermal imager, temperature distribution and variation are explored, which shows that the temperature on the solder loops is a function of the area and edge width in the induction heating. The temperature difference between the solder loop and its center on PCB is about 180℃, which shows an obvious localized heating effect. Thermal images of circle and square solder array indicate uniform temperature distribution on the PCB in the induction heating. Good agreement between measured and simulated temperature variation have been achieved.
机译：讨论了晶片级封装的局部感应加热。本文旨在研究感应加热中焊剂回路的几何形状与温度分布之间的关系。使用有限元方法（FEM）和红外热像仪，研究了温度分布和变化，结果表明，在感应加热中，焊环上的温度是面积和边缘宽度的函数。焊剂环路与PCB中心之间的温差约为180℃，显示出明显的局部加热效果。圆形和方形焊料阵列的热图像表明感应加热中PCB上的温度分布均匀。在实测和模拟温度变化之间已经取得了良好的一致性。

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  • 来源
  • 会议地点 Beijing(CN)
  • 作者

    Mingxiang Chen; Wenming Liu; Yanyan Xi; Changyong Lin; Sheng Liu;

  • 作者单位

    Division of MOEMS, Wuhan National Laboratory for Optoelectronics, Wuhan, China, 430074 Institute of Microsystems, School of Mechanical Engineering, HUST, Wuhan, China, 430074;

    Division of MOEMS, Wuhan National Laboratory for Optoelectronics, Wuhan, China, 430074 Institute of Microsystems, School of Mechanical Engineering, HUST, Wuhan, China, 430074;

    Division of MOEMS, Wuhan National Laboratory for Optoelectronics, Wuhan, China, 430074 Institute of Microsystems, School of Mechanical Engineering, HUST, Wuhan, China, 430074;

    Division of MOEMS, Wuhan National Laboratory for Optoelectronics, Wuhan, China, 430074 Institute of Microsystems, School of Mechanical Engineering, HUST, Wuhan, China, 430074;

    Division of MOEMS, Wuhan National Laboratory for Optoelectronics, Wuhan, China, 430074 Institute of;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 包装工程;
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