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首页> 外文会议>Electronic Packaging Technology amp; High Density Packaging, 2009. ICEPT-HDP '09 >Modeling Solder Joint Reliability of VFBGA Packages under Board Level Drop Test Based on Dynamic Constitutive Relation with Thermal Effect
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Modeling Solder Joint Reliability of VFBGA Packages under Board Level Drop Test Based on Dynamic Constitutive Relation with Thermal Effect

机译：基于动态本构关系和热效应的VFBGA封装焊点可靠性在板级跌落测试下的建模

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摘要

In this paper, according to the condition B in the drop test standard of JEDEC, create 3D finite element model of VFBGA (very-thin-profile fine-pitch BGA) packages in drop and impact, the material model of solder joints can be indicated by Cowper-Symonds model obtained from experiment data, taking into the consideration of strain rate and temperature effect. Comparing with traditional elastic for solder balls, this material model has better correlation with experimental measurement of dynamic strain, PCB center deflection. For conducting reliable analysis of VFBGA packaging in board-level drop condition, impact acceleration curve is applied to numerical simulation in input-G method.
机译：本文根据JEDEC跌落测试标准中的条件B，在跌落和冲击下创建VFBGA（超薄型细间距BGA）封装的3D有限元模型，可以指出焊点的材料模型通过考伯-西蒙兹模型从实验数据中获得，同时考虑了应变速率和温度效应。与传统的焊锡球弹性相比，这种材料模型与动态应变，PCB中心挠度的实验测量具有更好的相关性。为了对板级跌落条件下的VFBGA封装进行可靠的分析，将冲击加速度曲线应用于input-G方法的数值模拟。

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  • 来源
  • 会议地点 Beijing(CN)
  • 作者

    Xiaoyan Niu; Tong Chen; Zhigang Li; Xuefeng Shu;

  • 作者单位

    Institute of Applied Mechanics Biomedical Engineering, Taiyuan University of TechnologyNo.79 West Yingze Street, Taiyuan, 030024, Shanxi, China College of Civil Engineering and Architecture, Hebei UniversityNo.180 Wusi East Road, Baoding, 071002,H;

    Institute of Applied Mechanics Biomedical Engineering, Taiyuan University of TechnologyNo.79 West Yingze Street, Taiyuan, 030024, Shanxi, China;

    Institute of Applied Mechanics Biomedical Engineering, Taiyuan University of TechnologyNo.79 West Yingze Street, Taiyuan, 030024, Shanxi, China;

    Institute of Applied Mechanics Biomedical Engineering, Taiyuan University of Technology No.79 West Yingze Street, Taiyuan, 030024, Shanxi, China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 包装工程;
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