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首页> 外文会议>EPP-vol.6; American Society of Mechanical Engineers(ASME) International Mechanical Engineering Congress and Exposition; 20061105-10; Chicago,IL(US) >A NOVEL PROJECTION MOIRE SYSTEM FOR MEASURING PWBA WARPAGE DURING SIMULATED OPTIMIZED CONVECTIVE REFLOW PROCESS
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A NOVEL PROJECTION MOIRE SYSTEM FOR MEASURING PWBA WARPAGE DURING SIMULATED OPTIMIZED CONVECTIVE REFLOW PROCESS

机译：模拟优化对流回流过程中测量PWBA翘曲的新型投影波纹系统

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摘要

The shadow moire technique is a widely used method of measuring printed wiring board (PWB) warpage. It has a high resolution, high accuracy and is suitable for use in an online environment. A shortcoming of the shadow moire technique is that it cannot be used to measure PWBs populated with chip packages. In this paper, a novel warpage measurement system based on the projection moire technique is presented. The system can be used to measure bare PWBs as well as PWBs populated with chip packages. In order to use the projection moire system to accurately determine the warpage of PWBs and chip packages separately, an automated chip package detection algorithm based on active contours is utilized. Unlike the shadow moire technique which uses a glass grating, the projection moire technique uses a virtual grating. The virtual grating sizes can be adjusted, making it versatile for measuring various PWB and chip package sizes. Without the glass grating, which is a substantial heat inertia, the PWB/PWBA/chip package sample can be heated more evenly during the thermal process. The projection moire system described in this paper can also be used to measure PWB/PWBA/chip package warpage during convective reflow processes. In this paper, the characteristics of the projection moire warpage measurement system will be described. In addition, the system will be used to measure the warpage of a PWB and plastic ball grid array (PBGA) packages during a Lee optimized convective reflow process. It is concluded that this projection moire warpage measurement system is a powerful tool to study the warpage of populated PWBs during convective reflow processes.
机译：阴影波纹技术是测量印刷线路板（PWB）翘曲的一种广泛使用的方法。它具有高分辨率，高精度，并且适合在在线环境中使用。阴影波纹技术的缺点是不能用于测量装有芯片封装的PWB。本文提出了一种基于投影波纹技术的新型翘曲测量系统。该系统可用于测量裸露的PWB以及装有芯片封装的PWB。为了使用投影波纹系统分别准确地确定PWB和芯片封装的翘曲，利用了基于主动轮廓的自动芯片封装检测算法。与使用玻璃光栅的阴影波纹技术不同，投影波纹技术使用虚拟光栅。可以调整虚拟光栅的尺寸，使其可以用于测量各种PWB和芯片封装尺寸。如果没有玻璃格栅，而玻璃格栅具有很大的热惯性，则可以在加热过程中更均匀地加热PWB / PWBA /芯片封装样品。本文描述的投影莫尔条纹系统还可以用于测量对流回流焊过程中的PWB / PWBA /芯片封装翘曲。在本文中，将描述投影云纹翘曲测量系统的特性。此外，该系统将用于在Lee优化的对流回流过程中测量PWB和塑料球栅阵列（PBGA）封装的翘曲。结论是，该投影莫尔条纹翘曲测量系统是研究对流回流过程中填充的PWB翘曲的有力工具。

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