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首页> 外文会议>EPP-vol.6; American Society of Mechanical Engineers(ASME) International Mechanical Engineering Congress and Exposition; 20061105-10; Chicago,IL(US) >AUTOMATION AND CUSTOMIZATION OF CHIP SCALE MODELING FOR ELECTRONIC PACKAGING
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AUTOMATION AND CUSTOMIZATION OF CHIP SCALE MODELING FOR ELECTRONIC PACKAGING

机译：电子包装芯片规模模型的自动化和自定义

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摘要

Miniaturization in the electronics industry has made electronic packaging a very critical area of design and it has become crucial in gaining competitive advantage in a constantly evolving and dynamic market. One key to fast, reliable and economical electronic packaging design is quick modeling of the components and assemblies and accurate thermo-mechanical analyses. With quicker modeling there can be a greater focus on other analyses like fatigue, drop, shipping shock, moisture absorption/desorption etc. This paper presents ongoing work to automate a large part of electronic chip scale package modeling that can lead to a considerable reduction in lead time in modeling and can result in significant savings for the electronic industry. Through a host of ABAQUS scripts, modeling of multi-layered chip scale package (CSP) has been customized and has been made parameter based which can be easily manipulated by the user using ABAQUS/CAE. Solder ball modeling, which is a major component of the CSP modeling effort, is critical in analysis and consumes maximum time in chip-scale modeling due to its repetitive nature has also been automated and customized for ABAQUS/CAE. This approach can produce a big leap in chip scale modeling and analysis as the scripts can be embedded in larger automated systems that can result in a high degree of efficiency and cost saving. The paper thus discusses the methodology, scope and application of automation in CSP modeling.
机译：电子行业的小型化已使电子封装成为非常关键的设计领域，并且在不断变化和不断变化的市场中获得竞争优势已变得至关重要。快速，可靠和经济的电子包装设计的关键之一是快速建模零件和组件以及进行准确的热机械分析。通过更快的建模，可以将更多的精力放在其他分析上，例如疲劳，跌落，运输冲击，水分吸收/解吸等。本文介绍了正在进行的工作，以使大部分电子芯片级封装建模自动化，这可以大大降低封装尺寸。提前进行建模，可以为电子行业节省大量资金。通过许多ABAQUS脚本，可以定制多层芯片规模封装（CSP）的建模，并已将其设为基于参数的参数，用户可以轻松地使用ABAQUS / CAE对其进行操作。焊球建模是CSP建模工作的主要组成部分，在分析中至关重要，并且由于其重复性已经针对ABAQUS / CAE进行了自动化和定制，因此在分析中至关重要，并且在芯片级建模中消耗了最多的时间。这种方法可以在芯片规模的建模和分析方面产生巨大的飞跃，因为脚本可以嵌入更大的自动化系统中，从而可以提高效率和节省成本。因此，本文讨论了CSP建模中自动化的方法，范围和应用。

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