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首页> 外文会议>EPP-vol.6; American Society of Mechanical Engineers(ASME) International Mechanical Engineering Congress and Exposition; 20061105-10; Chicago,IL(US) >AN EXPERIMENTAL STUDY ON VOIDS IN MIXED ALLOY ASSEMBLIES
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AN EXPERIMENTAL STUDY ON VOIDS IN MIXED ALLOY ASSEMBLIES

机译：混合合金中空洞的实验研究

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The electronics manufacturing industry is gradually migrating towards to a lead-free environment. During this transition, there will be a period where lead-free materials will need to coexist with those containing lead on the same assembly. The use of tin-lead solder with lead-free parts and lead-free solder with components containing lead can hardly be avoided. If it can be shown that lead-free Ball Grid Arrays (BGAs) can be successfully assembled with tin-lead solder while concurrently obtaining more than adequate solder joint reliability, then the Original Equipment Manufacturers (OEMs) will accept lead-free components regardless of the attachment process or material used. Consequently, the Electronics Manufacturing Service (EMS) providers need not carry both the leaded and the unleaded version of a component. Solder voids are the holes and recesses that occur in the joints. Some say the presence of voids is expected to affect the mechanical properties of a joint and reduce strength, ductility, creep, and fatigue life. Some believe that it may slow down crack propagation by forcing a re-initiation of the crack. Consequently, it has the ability to stop a crack. The primary objective of this research effort is to develop a robust process for mixed alloy assemblies such that the occurrence of voids is minimized. Since there is no recipe currently available for mixed alloy assemblies, this research will study and 'optimize' each assembly process step. The difference between the melting points of lead-free (217℃) and tin-lead (183℃) solder alloys is the most important constraint in a mixed alloy assembly. The effect of voids on solder joint reliability in tin-lead assembly is well documented. However, its effect on lead-free and mixed alloy assemblies has not received due attention. The secondary objective of this endeavor is to determine the percentage of voids observed in mixed alloy assemblies and compare the results to both tin-lead and lead-free assemblies. The effect of surface finish, solder volume, reflow profile parameters, and component pitch on the formation of voids is studied across different assemblies. A designed experiments approach is followed to develop a robust process window for mixed alloy assemblies. Reliability studies are also conducted to understand the effect of voids on solder joint failures when subjected to accelerated testing conditions.
机译：电子制造业正逐渐向无铅环境迁移。在此过渡期间，将有一段时间需要将无铅材料与包含铅的材料共存于同一组件中。不可避免地要使用无铅部件的锡铅焊料和含铅成分的无铅焊料。如果可以证明无铅球栅阵列（BGA）可以成功地与锡铅焊料组装在一起，同时又获得了足够的焊点可靠性，那么原始设备制造商（OEM）将接受无铅组件，无论附着过程或使用的材料。因此，电子制造服务（EMS）提供商无需同时携带组件的含铅版本和无铅版本。焊锡空隙是在接头处出现的孔和凹口。有人说，空隙的存在有望影响接头的机械性能，并降低强度，延展性，蠕变和疲劳寿命。一些人认为，它可能会通过强制重新初始化裂纹来减慢裂纹的传播。因此，它具有阻止裂纹的能力。这项研究工作的主要目的是为混合合金组件开发一种可靠的工艺，以最大程度地减少空隙的发生。由于目前没有适用于混合合金装配的配方，因此本研究将研究和“优化”每个装配工艺步骤。无铅（217℃）和锡铅（183℃）焊料合金的熔点之间的差异是混合合金装配中最重要的限制。空隙对锡铅组装中焊点可靠性的影响已得到充分证明。但是，其对无铅和混合合金组件的影响尚未引起应有的重视。这项工作的第二个目的是确定在混合合金组件中观察到的空隙百分比，并将结果与​​锡铅和无铅组件进行比较。研究了跨不同组件的表面光洁度，焊料量，回流曲线参数和组件间距对空隙形成的影响。遵循设计的实验方法，为混合合金组件开发了可靠的工艺窗口。还进行了可靠性研究，以了解孔隙在加速测试条件下对焊点失效的影响。

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