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Effect of Hook Location for Ultra Fine Pitch Wirebonding Pull Testing Method

机译：钩位置对超细间距引线键合拉力测试方法的影响

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摘要

Over the years the methods for checking bonding quality during volume production still remains the same. These inspection methods like ball shear to test the first bond quality and wire pull to test the second bond integrity and quality have proven to be acceptable and achievable for many current industrial needs. However, driven by the relentless pursuit of dimensional reduction in wire bonding technology which calls for reduction in wire diameter, these conventional methods may not be sufficient. The interaction between machine, bonding tools, materials and the different categories of failure modes and mechanism during this quality test has become much more sensitive. The intent of this paper is to study and define the different categories of failure modes during 2~(nd )bond test for ultra fine gold wire from 15 micron diameter up to 50 micron diameter. Therefore, lifted stitch or lifted 2~(nd )bond which is a failure description known to be a 'reject' before can be re-visited. Analysis found that the two different test locations revealed that test location B or placing the hook as near possible to the leads where the 2~(nd )bond was bonded is the better method to test the 2~(nd )bond strength and performance as compared to the earlier bond pull method (location A).
机译：多年来，在批量生产期间检查粘合质量的方法仍然保持不变。这些检查方法（例如用于测试第一键合质量的球形剪切和用于测试第二键合完整性和质量的拉线方法）已被证明对于许多当前的工业需求都是可以接受的和可实现的。然而，在不懈地追求减小引线键合技术的尺寸减小的要求的推动下，这些传统方法可能不足。在此质量测试期间，机器，接合工具，材料以及不同类别的故障模式和机制之间的相互作用变得更加敏感。本文的目的是研究和定义直径从15微米到最大50微米的超细金线在2键测试中的不同失效模式类别。因此，可以再次查看被提起的针脚或被提起的2（nd）键，这是以前被称为“拒绝”的故障描述。分析发现，这两个不同的测试位置表明，将测试位置B或将钩子放置在尽可能靠近结合2〜（nd）键的引线的位置，是测试2〜（nd）键强度和性能的更好方法，因为与早期的拉键方法（位置A）相比。

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