Process development for 3D laser lithography

机译：3D激光光刻的工艺开发

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The field of micro-electro-mechanical-systems (MEMS) grew out from the integrated circuit (1C) industry. So far the main fabrication techniques used in MEMS are planar technologies, which set limitations to the sensor/actuator design. Therefore greyscale (3D) technology seems to be the method for fabrication of three-dimensional structures in a single lithography and etching step. The idea in fabricating a 3D photoresist structure is the controlled transmission of UV light intensity during the exposure process. The result of this work is to provide a preliminary process solution for the formation of nearly arbitrarily shaped 3D forms in photoresist using Heidelberg Instrument DWL 66FS direct writing lithography tool. For this purpose, the investigation results of the exposure tool possibilities of the photoresist selection for 3D applications and as a real greyscale application, slopes with different angles, which will be used for making a tactile sensor, are provided.

机译：微电子机械系统（MEMS）领域是从集成电路（1C）行业发展而来的。到目前为止，MEMS中使用的主要制造技术是平面技术，这限制了传感器/执行器的设计。因此，灰度（3D）技术似乎是在单个光刻和蚀刻步骤中制造三维结构的方法。制造3D光致抗蚀剂结构的想法是在曝光过程中UV光强度的受控透射。这项工作的结果是为使用Heidelberg Instrument DWL 66FS直写光刻工具在光刻胶中形成几乎任意形状的3D形式提供一个初步的工艺解决方案。为了这个目的，提供了用于3D应用和作为真实灰度应用的光刻胶选择的曝光工具可能性的调查结果，提供了将用于制造触觉传感器的具有不同角度的斜率。

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来源
《High performance and optimum design of structures and materials》|2014年|139-150|共12页
会议地点 Ostend(BE)
作者
N. Kaste; A. Filbert; U. Mescheder; T. Rang; G. Rang;
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作者单位

Surgitech Ltd., Estonia;

Faculty of Computer and Electrical Engineering, Furtwangen University, Germany;

Faculty of Computer and Electrical Engineering, Furtwangen University, Germany;

Thomas Johann Seebeck Department of Electronics, Tallinn University of Technology, Estonia;

Thomas Johann Seebeck Department of Electronics, Tallinn University of Technology, Estonia;

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原文格式 PDF
正文语种 eng
中图分类
关键词
MEMS; greyscale; direct laser writing; 3D photolithography; tactile sensor; medical application;

机译：MEMS;灰度直接激光书写； 3D光刻；触觉传感器医疗应用;

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1. Beyond 100 nm resolution in 3D laser lithography - Post processing solutions [J] . Seniutinas G., Weber A., Padeste C., Microelectronic Engineering . 2018,第MAY期

机译：3D激光光刻技术中的分辨率超过100 nm-后处理解决方案
2. 3D whispering-gallery-mode microlasers by direct laser writing and subsequent soft nanoimprint lithography [J] . Brenner Philipp, Bar-On Ofer, Siegle Tobias, Applied optics . 2017,第13期

机译：3D耳语 - 画廊模式微加可通过直接激光写入和随后的软纳米压印光刻
3. Development of processing strategies for 3D controlled laser ablation: Application to the cleaning of stonework surfaces [J] . Optics and Lasers in Engineering . 2020,第Mara期

机译：开发用于3D控制的激光烧蚀的加工策略：在石材加工表面的清洁中的应用
4. Process development for 3D laser lithography [C] . N. Kaste, A. Filbert, U. Mescheder, International conference on high performance and optimum design of structures and materials . 2014

机译：用于3D激光光刻的过程开发
5. Flexible electronics fabrication by lithography-free low temperature metal nanoparticle laser processing. [D] . Ko, Seung Hwan. 2006

机译：通过无光刻的低温金属纳米粒子激光加工进行柔性电子制造。
6. Vegetable Oil-Based Thiol-Ene/Thiol-Epoxy Resins for Laser Direct Writing 3D Micro-/Nano-Lithography [O] . Sigita Grauzeliene, Aukse Navaruckiene, Edvinas Skliutas, 2021

机译：植物油基硫醇-NEE /硫醇 - 环氧树脂用于激光直接写入3D微/纳米光刻
7. Processes of Direct Laser Writing 3D Nano-Lithography [O] . Simonas Varapnickas, Mangirdas Malinauskas 2018

机译：直激光写入3D纳米光刻的过程
8. Development of free-electron lasers for xuv projection lithography. [R] . Newnam, B. E. 1990

机译：用于xuv投影光刻的自由电子激光器的开发。

Process development for 3D laser lithography

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