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首页> 外文会议>International conference on high performance and optimum design of structures and materials >Process development for 3D laser lithography
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Process development for 3D laser lithography

机译：用于3D激光光刻的过程开发

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The field of micro-electro-mechanical-systems (MEMS) grew out from the integrated circuit (1C) industry. So far the main fabrication techniques used in MEMS are planar technologies, which set limitations to the sensor/actuator design. Therefore greyscale (3D) technology seems to be the method for fabrication of three-dimensional structures in a single lithography and etching step. The idea in fabricating a 3D photoresist structure is the controlled transmission of UV light intensity during the exposure process. The result of this work is to provide a preliminary process solution for the formation of nearly arbitrarily shaped 3D forms in photoresist using Heidelberg Instrument DWL 66FS direct writing lithography tool. For this purpose, the investigation results of the exposure tool possibilities of the photoresist selection for 3D applications and as a real greyscale application, slopes with different angles, which will be used for making a tactile sensor, are provided.
机译：微电机系统（MEMS）领域从集成电路（1C）行业延伸。到目前为止，MEMS中使用的主要制造技术是平面技术，其设定了对传感器/执行器设计的限制。因此，灰度（3D）技术似乎是在单光刻和蚀刻步骤中制造三维结构的方法。制造3D光致抗蚀剂结构的想法是在曝光过程中的UV光强度的控制传动。该工作的结果是提供使用海德堡仪器DWL 66FS直接写入光刻工具在光致抗蚀剂中形成近似任意形状的3D形式的初步过程解决方案。为此目的，提供了3D应用的光致抗蚀剂选择和作为真实灰度应用的曝光工具的调查结果，其具有不同角度的斜率，该角度将用于制造触觉传感器。

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