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A STUDY OF THIN METAL FILM FORMATION ON LTCC SUBSTRATE

机译:LTCC基板上的金属薄膜形成研究

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摘要

The convention method of surface electrode formation is that the electrode paste such as Ag, Cu is used to maintain surface electrode on LTCC substrate by screen printer, which is connected through inner via electrically. The above patterns of electrode have serious effects such as the thickness non uniformity, unclearance of line and space and bad brightness. It is very difficult for these patterns to perform fine surface patterns for electrode pad. Therefore, this study has investigated thin film formation by sputter method instead of screen printing method. The used metal electrodes are Ti, Cu. We have analyzed bonding strength interlace between LTCC and surface electrodes and have evaluated the structural morphology. The results confirm that adhesion strength is further improved by thick seed layer and electroform plating, as thickness of Ti seed layer increase in particular.
机译:表面电极形成的常规方法是使用诸如银,铜之类的电极浆料通过丝网印刷机将表面电极保持在LTCC基板上,该丝网印刷机通过内部通孔电连接。电极的上述图案具有严重的影响,例如厚度不均匀,线和空间的不清晰以及亮度差。这些图案很难对电极焊盘执行精细的表面图案。因此,本研究研究了通过溅射法代替丝网印刷法形成薄膜。所使用的金属电极是Ti,Cu。我们分析了LTCC和表面电极之间的粘合强度交错,并评估了结构形态。结果证实,特别是随着Ti种子层的厚度增加,通过厚的种子层和电铸电镀进一步提高了粘合强度。

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