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首页> 外文会议>IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain >High Speed Dispensing Solutions for Packaging and Manufacturing
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High Speed Dispensing Solutions for Packaging and Manufacturing

机译：包装和制造的高速点胶解决方案

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Packaging is one of the key components for manufacturing of compact functional devices. Screen printing has beenrnan important process for patterning a number of electronic devices, however, as the critical dimensions continue tornshrink, this technology has been challenged by its accuracy and dimensionality. In order to solve this problem whilernkeeping high productivity, nScrypt Inc. has developed high speed dispensing technology for packaging andrnmanufacturing finer features such as conductive lines, resistors and dielectric insulators. As a through nozzlerndispensing technology, the nozzle (tip) has been optimized to a conical shape, which reduces the pressure that isrnneeded to extrude the material (e.g. paste) through the opening, thus enabling high speed dispensing. Thisrntechnology can handle material from very low viscosities to high viscosities (several million centipoises). A largernnumber of materials have been dispensed at several hundred mm/second, which qualifies it as high speedrndispensing. To further enhance the speed, parallel dispensing has been employed and demonstrated in this paper. Arnheight sensor, normally a laser based sensor, is integrated to acquire the z data for conformal and true 3D surface,rnwhich makes it possible to dispense on conformal and even true 3D surface. A novel pumping technology, whichrnemploys a special needle valve mechanism to control flow on and off ensures that material is accurately dispensedrnand placed in an x, y, z map. The needle valve technology enables pico-liter level volumetric control of therndispensed material. Micro resolution x, y and z stages are integrated to the system, which enables the precisernplacement of dispensed features. In the paper, dispensed micro dots, lines and patterns will be presented. In addition,rn3D printing and high speed dispensing will be presented. This technology has various applications, including but notrnlimited to, electronic packaging, manufacturing, solar industry, biomedical applications, electro optical applicationsrnand next generation hybrids.
机译：包装是制造紧凑功能设备的关键组件之一。丝网印刷是对许多电子设备进行构图的重要工艺，但是，随着关键尺寸的不断缩小，这项技术一直受到其准确性和尺寸的挑战。为了在保持高生产率的同时解决该问题，nScrypt Inc.开发了用于包装和制造更细小的特征（例如导线，电阻器和介电绝缘子）的高速分配技术。作为直通式喷嘴分配技术，喷嘴（尖端）已优化为圆锥形，从而降低了通过开口挤出材料（例如糊剂）所需的压力，从而实现了高速分配。该技术可以处理从极低粘度到高粘度（几百万厘泊）的材料。已经以数百毫米/秒的速度分配了大量的材料，这使其具有高速分配的资格。为了进一步提高速度，本文采用并分配了并行分配。 Arnheight传感器（通常是基于激光的传感器）被集成以获取共形和真实3D表面的z数据，从而可以在共形甚至真实3D表面上进行分配。一种新颖的泵送技术，采用特殊的针阀机构来控制流量的开和关，可确保正确分配物料并将其放置在x，y，z图中。针阀技术可实现皮脂级的分配材料体积控制。微型分辨率的x，y和z平台已集成到系统中，从而可以精确放置分配的特征。在本文中，将介绍分配的微点，线条和图案。此外，还将展示3D打印和高速分配。该技术具有多种应用，包括但不限于电子包装，制造，太阳能行业，生物医学应用，电光应用和下一代混合动力。

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