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首页> 外文会议>IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain >RF System in Package Design for Portability Between Suppliers and Technology Platforms
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RF System in Package Design for Portability Between Suppliers and Technology Platforms

机译：包装设计中的射频系统，可在供应商和技术平台之间移植

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Today, the System-in-Package approach offers a new dimension to system integration, far beyond mere dense micro-packaging of existing System on Chip solutions. Not only does SiP offer the capability to integrate almost any kind of companion passive component with a given active circuit, but it also enables flexible combinations of analogue circuits and RF functions with digital integrated circuits. The SiP approach is a key driver for the miniaturization trend for portable devices (Cell-phones, PDAs, Ultra-miniature PCs), particularly with respect to the growing number of RF functions that need to be integrated.rnMost SiP design methodologies, that include integrated passive components, rely on fixed libraries of components that are locked to a particular substrate supplier and stack-up. For high volume consumer devices it is increasingly important to ensure that any given SiP can be sourced from at least two independent manufacturers.rnThe novel design methodology that is presented in this paper is aimed at allowing easy transfer of integrated passive circuit design from one supplier to another and even from one technology to another (e.g. LTCC to IPD).rnThe methodology is based on a user extendable library of mechanical objects for which the electrical models are created automatically for a given stack-up and/or technology. Thus any design that is initially made for a particular supplier can easily be re-tuned for an alternative source. The second manufacturer can have a completely separate set of electro-mechanical parameters (stack-up, dielectric constant, layer thickness, loss factors, metal types) and may even use an alternative technology.rnThe paper will illustrate the design method with some examples of RF SiP designs that have been ported between LTCC suppliers and between LTCC and IPD technologies.
机译：如今，系统级封装方法为系统集成提供了一个新的维度，远远超出了现有片上系统解决方案的密集封装。 SiP不仅可以将几乎任何种类的配套无源元件与给定的有源电路集成在一起，而且还可以实现模拟电路和RF功能与数字集成电路的灵活组合。 SiP方法是推动便携式设备（手机，PDA，超微型PC）小型化趋势的关键驱动力，尤其是在需要集成的射频功能不断增长的情况下。rn大多数SiP设计方法包括集成的无源元件依赖于固定在特定基板供应商和堆叠上的固定元件库。对于大容量消费类设备，确保任何给定的SiP都可以从至少两个独立的制造商处采购就变得越来越重要。本文介绍的新颖设计方法旨在使集成无源电路设计可以轻松地从一个供应商转移到一个供应商。另一种方法，甚至是从一种技术到另一种技术（例如从LTCC到IPD）。该方法基于用户可扩展的机械对象库，对于给定的堆叠和/或技术，将自动为其创建电气模型。因此，最初为特定供应商设计的任何设计都可以轻松地重新调整为替代货源。第二家制造商可以拥有一套完全独立的机电参数（堆积，介电常数，层厚度，损耗因子，金属类型），甚至可以使用替代技术。本文将通过一些示例来说明设计方法。已经在LTCC供应商之间以及LTCC和IPD技术之间移植了RF SiP设计。

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