Thick Al Ribbon Interconnects: A Feasible Solution for Power Devices Packaging

著录项

• 来源
  《IMAPS 2008 - 41st international symposium on microelectronics: bringing together the entire microelectronics supply chain》|2008年|p.001056-001063|共8页
• 会议地点 Providence RI(US);Providence RI(US)
• 作者

  Wei Sun Loh; Pearl A. Agyakwa; C. Mark Johnson; Tick-Kwang Loh; Christoph Luechinger; Kristian Oftebro;

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• 作者单位

  Department of Electronic and Electrical Engineering, The University of Sheffield, Mappin Street, Sheffield, S1 3JD, UK;

  rnSchool of Electrical and Electronic Engineering, University of Nottingham, University Park Nottingham, NG7 2RD, U.K;

  rnSchool of Electrical and Electronic Engineering, University of Nottingham, University Park Nottingham, NG7 2RD, U.K Tel: +44 115 846 8685 Email: mark.johnson@nottingham.ac.uk;

  rnOrthodyne Electronics Corporation, 16700 Red Hill Ave, Irvine, CA 92606-4802, U. S. A.;

  rnOrthodyne Electronics Corporation, 16700 Red Hill Ave, Irvine, CA 92606-4802, U. S. A.;

  rnOrthodyne Electronics Corporation, 16700 Red Hill Ave, Irvine, CA 92606-4802, U. S. A.;

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• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类 微电子学、集成电路（IC）;
• 关键词

  aluminum; ribbon bond; reliability; thermal cycling; bond parameters;

  机译：铝;丝带键可靠性;热循环；键参数;