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首页> 外文会议>IMAPS 40th international symposium on microelectronics >Vacuum Micropackaging Technology for MEMS
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Vacuum Micropackaging Technology for MEMS

机译：MEMS真空微包装技术

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Vacuum wafer-level packaging is a key issue in the technology development path to low-cost,high volume production of a number of MEMS. Vacuum packaging of uncooled microbolometer detectors used for infrared imaging applications is essential to minimize the thermal conductance through residual gas in the package. INO’s wafer-level micropackaging technology allows for the solder bonding at low temperatures of known good dies and various infrared windows onto a spacer wafer,using conventional flip-chip bonding equipment operated in air. Consequently,cavity volumes of several tens of microliters can be achieved for enhanced long-term vacuum integrity. The technology also offers the advantages of dicing through only one wafer as well as dissociated assembly and vacuum sealing steps where the device is baked-out under vacuum and sealed using a solder ball. Fluxless processes were developed for steps involving the MEMS chip. The wafer-scale fabrication of alumina spacers and antireflection coated-IR windows equipped with a solderable layer is based on standard thin film metallization and laser micromachining techniques. To monitor in-situ pressure changes within the package cavity,micromachined integrated pressure sensors were fabricated. This paper reports on the vacuum performance of micropackaged 160x120 pixel focal plane array (FPA) dies based on vanadium oxide and micromachined pressure gauge chips,submitted to accelerated testing at various temperatures with or without the incorporation of a nonrefireable getter. Results show that cavity pressures of less than 10 mTorr can be obtained resulting in a NETD less than 100 mK. The importance of ROIC conditioning is also highlighted.
机译：真空晶圆级封装是低成本，大批量生产多个MEMS的技术开发路径中的关键问题。对于红外成像应用，未冷却的微辐射热检测器的真空包装对于使通过包装中残留气体的热导最小化至关重要。 INO的晶圆级微封装技术允许使用传统的倒装芯片焊接设备在空气中在低温下将已知良好管芯和各种红外窗口的焊料焊接到间隔晶圆上。因此，可以实现数十微升的腔体容积，以增强长期真空完整性。该技术还具有仅通过一个晶片进行划片，分离的组装和真空密封步骤的优势，在该步骤中，器件在真空下被烘烤并使用焊球密封。针对涉及MEMS芯片的步骤开发了无助焊剂工艺。配备可焊层的氧化铝垫片和抗反射涂层红外窗口的晶圆级制造基于标准的薄膜金属化和激光微加工技术。为了监测包装腔内的原位压力变化，制造了微机械集成压力传感器。本文报道了基于钒氧化物和微机械压力计芯片的微封装160x120像素焦平面阵列（FPA）芯片的真空性能，该芯片可以在不同温度下加速测试，无论是否装有不可烧除的吸气剂。结果表明，可以获得小于10 mTorr的模腔压力，从而导致NETD小于100 mK。还强调了ROIC调节的重要性。

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