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首页> 外文会议>IMAPS 40th international symposium on microelectronics >Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au Finish
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Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au Finish

机译：Ni / Au表面处理BGA的Sn3.5Ag和Sn3.8Ag0.7Cu无铅合金的研究

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摘要

Sn3.5Ag and Sn3.8Ag0.7Cu (SAC387) Pb-free solder alloys on Ni/Au BGA pad finishing were studied for manufacturability, component mechanical robustness and board level reliability. Reflow profile windowing study showed that both alloys would form solder joint properly with profiles with peak temperature over 230℃. At individual solder joint level, Sn3.5Ag showed significantly lower intermetallic brittle failure rate compared to SAC387 in cold ball pull test. At package level, Sn3.5Ag survived 8～10x more drop cycles than SAC387 in tray drop and packing drop tests. These results indicate that the mechanical strength of Sn3.5Ag on Ni/Au pad is considerably stronger than that of SAC387. The difference in mechanical strength between the two alloys was correlated to their microstructures. At the same time, board level solder joint reliability tests such as thermal cycling and mechanical bend test were carried out. Sn3.5Ag showed similar performance compared to SAC387.
机译：研究了在Ni / Au BGA焊盘表面处理的Sn3.5Ag和Sn3.8Ag0.7Cu（SAC387）无铅焊料合金的可制造性，组件机械强度和板级可靠性。回流曲线开窗研究表明，两种合金均能正确形成焊点，且峰值温度超过230℃。在单个焊点水平上，Sn3.5Ag在冷球拉拔试验中显示出比SAC387低得多的金属间脆性破坏率。在包装水平上，在托盘跌落和包装跌落测试中，Sn3.5Ag的跌落循环比SAC387多8-8倍。这些结果表明，Sn3.5Ag在Ni / Au垫上的机械强度明显强于SAC387。两种合金之间的机械强度差异与它们的微观结构有关。同时，进行了板级焊点可靠性测试，例如热循环和机械弯曲测试。 Sn3.5Ag与SAC387表现出相似的性能。

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  • 来源
  • 会议地点 San Jose CA(US)
  • 作者

    Poh-Leng Eu; Min Ding; Ibrahim Ahmad;

  • 作者单位

    Freescale Semiconductor Malaysia Sdn. Bhd.No. 2, Jalan SS 8/2 Free Industrial Zone Sungei Way Petaling Jaya 47300 603-78734247, r38158@freescale.com;

    Freescale Semiconductor, Inc.Wireless and Packaging Systems Laboratories 6501 West William Cannon Drive, Austin, Texas 78735, USA 1-512-895-3517, 1-512-895-7149,min.ding@freescale.com;

    Department of Electrical, Electronics System,National University of Malaysiarn43600 Bangi, Selangor, Malaysia Tel: 603-89216322 Fax: 603-89216146;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 微电子学、集成电路（IC）;
  • 关键词

    Pb-free; alloy; ball grid array; reliability;

    机译：无铅合金;球栅阵列；可靠性;

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