The Research of Zero Shrinkage LTCC Tape for Integral Substrate / Package

机译：用于整体基板/封装的零收缩LTCC胶带的研究

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To meet the demand of multi-IC die assembly and multi-I/O terminal in MCM-C,This paper introduce the designing,manufacturing,and inspection of a kind of Integral Substrate / Package with PGA terminal which made from Heraeus zero shrinkage system by LTCC process. The large package formed by co-fired multi-layer substrate and metal ring,and it is a high sealed package that can do parallel-sealing.

机译：为了满足MCM-C中多IC芯片组装和多I / O端子的需求，本文介绍了一种由贺利氏零收缩系统制成的带PGA端子的整体基板/封装的设计，制造和检验。通过LTCC流程。由多层基板和金属环共同烧制而成的大包装，是可以平行密封的高密封包装。

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来源
《IMAPS 40th international symposium on microelectronics》|2007年|p.1-5|共5页
会议地点 San Jose CA(US)
作者
Zhongwei He; Charles Luo;
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作者单位

East China Photo-electronic IC Institute,18 Caiyuan Road, BengBu, Anhui,China, 233042,Tel:86-552-3113981, hezhongwei2003@163.com;

Heraeus Materials Technology Shanghai Ltd. Guangzhong Road, Shanghai,China, 201108,Tel:86-21-64891422, Charles.luo@heraeus.com;

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会议组织
原文格式 PDF
正文语种 eng
中图分类微电子学、集成电路（IC）;
关键词
ISP(Integral Substrate / Package); Zero shrinkage; PGA(Pin Gate Array); high sealed package;

机译：ISP（整体基板/封装）；零收缩； PGA（Pin Gate Array）;高密封包装;

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专利

1. Zero-Shrinkage LTCCs [J] . Christina Modes, Annette Kipka, Frieder Gora Ceramic Forum International . 2008,第4期

机译：零收缩LTCC
2. Control of De-Lamination Phenomena in LTCC Zero-Shrinkage by Glass Infiltration Method [J] . Jo Tae-Jin, Yeo Dong-Hun Transactions on Electrical and Electronic Materials . 2012,第1期

机译：玻璃渗透法控制LTCC零收缩中的分层现象
3. Three-dimensional structuration of zero-shrinkage LTCC ceramics for microfluidic applications [J] . Karol Malecha, Leszek J. Golonka Microelectronics reliability . 2009,第6期

机译：零收缩LTCC陶瓷的微流控应用三维结构
4. The Research of Zero Shrinkage LTCC Tape for Integral Substrate / Package [C] . Zhongwei He, Charles Luo International Symposium on Microelectronic . 2007

机译：用于整体基板/包装的零收缩LTCC胶带的研究
5. Micro zero-insertion-force (ZIF) connector for multi-substrate packages. [D] . Zhan, Yumei. 2003

机译：微型零插入力（ZIF）连接器，用于多基板封装。
6. LTCC Packaged Ring Oscillator Based Sensor for Evaluation of Cell Proliferation [O] . Joni Kilpijärvi, Niina Halonen, Maciej Sobocinski, 2018

机译：基于LTCC封装的环形振荡器的传感器用于评估细胞增殖
7. OPTIMIZATION OF SHRINKAGE AND SURFACE-ROUGHNESS OF LTCC TAPE [O] . Monika Dubey, N Suri, P K Khanna 2015

机译：LTCC胶带收缩和表面粗糙度的优化
8. Response Predicing LTCC Firing Shrinkage: A Response Surface Analysis Study [R] . Girardi, M., Barner, G., Lopez, C., 2009

机译：响应预测LTCC射击收缩：响应面分析研究

The Research of Zero Shrinkage LTCC Tape for Integral Substrate / Package

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