Formation and Growth of Intermetallic Compounds at the Interface between Pb-free Solder and Cu-Zn alloy UBM

著录项

• 来源
  《IMAPS 40th international symposium on microelectronics》|2007年|p.1-4|共4页
• 会议地点 San Jose CA(US)
• 作者

  Chang-Yul Oh; Hee-Ra Roh; Young-Ho Kim;

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• 作者单位

  Division of Materials Science Engineering, Hanyang University,17 Haengdang-dong, Seongdong-gu, Seoul, 133-791, Korea Phone: 82-2-2220-0405, Fax: 82-2-2293-7445;

  Division of Materials Science Engineering, Hanyang University,17 Haengdang-dong, Seongdong-gu, Seoul, 133-791, Korea Phone: 82-2-2220-0405, Fax: 82-2-2293-7445;

  Division of Materials Science Engineering, Hanyang University,17 Haengdang-dong, Seongdong-gu, Seoul, 133-791, Korea Phone: 82-2-2220-0405, Fax: 82-2-2293-7445,kimyh@hanyang.ac.kr;

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• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类 微电子学、集成电路（IC）;
• 关键词

  Cu-Zn alloy UBM; lead-free solders; intermetallic compounds; Zn addition;

  机译：铜锌合金UBM;无铅焊料；金属间化合物锌添加;