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首页> 外文会议>IMAPS 40th international symposium on microelectronics >Lead-Free Die Attach Reliability Assessment for High Temperature Environments
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Lead-Free Die Attach Reliability Assessment for High Temperature Environments

机译：高温环境下的无铅芯片附着可靠性评估

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摘要

The increasing demand for electronics capable of operating at temperatures above the traditional 125°C limit is driving major research efforts. Wide band gap semiconductors have been demonstrated to operate at temperatures up to 500°C, but packaging is still a major hurdle to product development. Recent regulations, such as RoHS and WEEE, increase the complexity of the packaging task as they prohibit the use of toxic materials in electronic products,lead being a major concern due to its widespread use in solder attach. In this investigation, a series of Pb-free die attach technologies have been identified as possible alternatives to Pb-based materials for high temperature applications. This paper describes the fabrication sequence used to create attachments with these materials. The long term reliability is also determined by accelerated thermal cycling and physics-of–failure modeling.
机译：能够在高于传统125°C极限温度的温度下运行的电子产品的需求不断增长，这推动了主要的研究工作。宽带隙半导体已被证明可以在高达500°C的温度下工作，但是封装仍然是产品开发的主要障碍。 RoHS和WEEE等最新法规增加了包装任务的复杂性，因为它们禁止在电子产品中使用有毒材料。铅由于其广泛用于焊接中而成为主要问题。在这项研究中，已确定了一系列无铅芯片附着技术，可以替代高温应用中基于铅的材料。本文介绍了用于创建这些材料的附件的制造顺序。长期可靠性还取决于加速的热循环和故障物理模型。

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